The Colorado School of Mines have been producing Geological Thin Sections on their LP30 (the ancestor of the precision lapping & polishing system, LP50) for over 40 years. The LP30 (which has been discontinued for approximately 30 years) is still in working condition and is used …

Automated systems help you reach your compound semiconductor wafer processing goals Semiconductor wafer processing, device development and production is fundamentally driven by cost and quality. Logitech addresses both of these fundamentals with our turnkey materials processing solutions, by reducing user workload and cost per wafer. Our …

With The Semiconductor Industry Association reporting 2016 global sales totaling a staggering $338.9 billion in 2016, the industry's highest annual sales, the Semiconductor market is definitely growing day by day. But with ever increasing industry requirements and the pressure for high productivity there is no room …

Geological thin sections are prepared for a number of different tests such as porosity definition. Preparing  high quality geological thin sections can present a significant challenge, even to the most experienced petrographer, when using materials such as concrete. The combination of soft cement matrix and hard …

The lapping & polishing of hard materials has always been problematic in a sector centered on high productivity with ever increasing industry requirements. Systems designed with process repeatability in mind can help remove the guesswork and ‘trial and error’ from your processes. Read more…