Application Process Notes

Logitech know how.

We have developed a wide range of  application notes in order for you to gain a deeper understanding of the technologies involved in working with certain materials and applications.

Each application note details process requirements, methodologies and system specifications required in order to process a sample to its optimum geometric control.

Geological Thin Section Preparation: LP70


Geological Thin Section Preparation: PM6

4” GaAs Wafer Backthinning

Polishing Fibre Arrays

Processing III-V Semiconductors: Indium Phosphide

PM6 Lapping machine

Advances in Indium Phosphide Processing: PM6

Fused Wafers

Silicon Carbide, Sapphire & Gallium Nitride
Substrate Preparation

Silicon on Silicon