Application Process Notes

Logitech know how.

We have developed a wide range of  application notes in order for you to gain a deeper understanding of the technologies involved in working with certain materials and applications.

Each application note details process requirements, methodologies and system specifications required in order to process a sample to its optimum geometric control.

Geological Thin Section Preparation: LP70

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Geo-thin-section

Geological Thin Section Preparation: PM6

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4” GaAs Wafer Backthinning

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Polishing Fibre Arrays

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Processing III-V Semiconductors: Indium Phosphide

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PM6 Lapping machine

Advances in Indium Phosphide Processing: PM6

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Fused Wafers

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Silicon Carbide, Sapphire & Gallium Nitride
Substrate Preparation

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Silicon on Silicon

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