Bringing an adaptable range of systems for defect free & edge polishing.

With over 50 years experience in the design and manufacture of high precision equipment.  We are well respected in Optoelectronic material processing to precise tolerances with scratch free surfaces.

Application Analysis

Our systems are typically used in the processing of:

  • Silicon
  • Sapphire
  • Silicon Carbide
  • Gallium Nitride
  • Diamond
  • Lithium Niobate
  • Lithium Tantalate,
  • Bismuth Silicon Oxide
  • Barium Titanate
  • Other opto-electronic materials

A Logitech system for polishing optoelectronic devices would typically include:

  • Slicing the wafer from the crystal boule
  • Smooth automated lapping / lapping of both wafer faces
  • Polishing one or both faces to achieve defect-free surfaces
  • Cutting of substrates from the polished wafer
  • Forming an optical guide channel on the polished surface
  • Bonding of diffused plates to form a stack between end wasters
  • Polishing ends flat and square with minimal edge roll-off and chipping

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