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Menu
  • Who we are
    • Our History
    • Quality & Accreditations
    • Our Environmental Policies
      • Our WEEE Policy
    • Careers
  • What we offer
    • By application
      • Semiconductors
      • Geological Sciences
      • Optoelectronics
      • Optics
      • Other applications
    • By material
      • Silicon
      • Silicon Carbide
      • Sapphire
      • Gallium Arsenide
      • Cadmium Zinc Telluride
      • Indium Phosphide
      • Rock/Soil
      • Other Materials
  • Products & Solutions
    • Lapping & Polishing
    • Chemical Polishing & Chemical Mechanical Polishing
    • Driven Head Lapping & Polishing Tools
    • Bonding & Impregnation Units
    • Test & Measurement
    • Cutting & Sawing
    • Accessories
    • Consumable Items
    • Consumables Store
  • Knowledge base
    • Whitepapers
    • Tech Files – Blog
    • Technology Transfer Programme
    • Brochures
    • Application Process Notes
    • Case Studies
    • FAQ
  • News & Events
    • News
    • Events
  • Contact
    • How to find us
    • Global Distributors
    • Equipment Returns

Bonding & Impregnation Units

Home  /  Bonding & Impregnation Units

Showing all 6 results

  • Bonding Jigs

    Bonding Jigs

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  • Hotplate

    Digital Hotplate

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  • IU30 Vacuum Impregnation Unit

    IU30 Vacuum Impregnation Unit

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  • Modular Wafer Substrate Bonder

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  • Solvent Vapour Cleaner

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  • WSBU Wafer Substrate Bonding Units

    WSBU Wafer Substrate Bonding Units

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