The most recent addition to our range of premium wafer bonders, the Modular Wafer Bonding System (MWBS). The MWBS offers a bonding capacity ,of small pieces of wafers and wafer sizes, from 2″ up to 8″. The modular design allows for up to 12 heads (with the capacity for expansion) from one single control unit. This saves valuable bench space and allows for easy, synchronous and asynchronous processing.
Due to the fully expandable modular design of the system, it is ideal for both R&D and production level facilities. Allowing a cost effective solution, the system is fully tailored to the exact bonding and throughput requirements of the customer.
- Wafer process capacity of small wafer pieces and wafer sizes from 2″ up to 8″ per bonding head.
- Modular design with expansion capacity allowing a cost effective solution tailored to your exact bonding requirements.
- Control up to 12 bonding heads (with the capacity for expansion) from a single control unit, saving valuable bench space and allowing for easy synchronous and asynchronous processing.
- Easy to use fully customised recipe controlled process cycles, process conditions set via graphical user interface including bonding temperature of up to 240°C and required vacuum.