The Logitech China team look forward to once again participating in SEMICON China 2024, a leading exhibition for China’s semiconductor industry, held 20 – 22 March, at Shanghai New International Expo Centre, Shanghai, China. SEMICON China brings together the world’s fastest growing and most dynamic microelectronics companies. Visit Logitech on booth #5134, where our technical experts will be on hand to provide information on our wide range of precision materials processing equipment and accessories.
On our booth, we will showcase a range of our lapping and polishing solutions, including the LP70 multi-station precision Lapping & Polishing System, a bench-top machine designed to run concurrent automated processes, allowing operators to achieve repeatable results to stringent sample specifications. Also on the booth, we will have the PM6 Lapping and Polishing solution – this bench-top, research & development scale machine reproduces processing results typically found on production scale equipment. We will also be showcasing our Wafer Substrate Bonding Unit (WSBU), designed for the safe bonding of fragile semiconductor wafers.
You can discuss these products or any of our systems and accessories with our local Logitech representative. Arrange a meeting at the show with our local Logitech representative by emailing enquiries@logitech.uk.com. Alternatively, visit booth #5134 to see the systems, understand their process capabilities, and learn how they can enhance the quality and throughput levels of your wafer fabrication activities.
