In many areas of geological study such as mineralogy, petrography and sedimentology you are required to analyse the characteristics of the materials such as soil or rock. To be able to do this a thin section needs to be prepared for microscopic examination.
Logitech precision equipment is ideal for thin or ultra-thin section preparation. Our wide range of versatile systems enable you to trim, lap and polish geological thin sections such as rock, coal, concete and soils.
Each of our systems are fully supported by a wide range of accessories and consumables, such as abrasive powders, polishing cloths and mounting media.
Semiconductor materials are used in a wide variety of devices such as field effect transistors (MosFets, Fets), integrated circuits (ICs, MMICs, ASICs), focal plane arrays and infra-red detectors.
Whatever the application or material, each semiconductor wafer undergoes several common stages during manufacture, which include slicing the wafer from the crystal, preparing the surface prior to fabrication and thinning the device after fabrication through the use of lapping and polishing techniques.
Logitech provide complete system solutions including consumables for the precise thinning of these III-V, I.R. and similar materials.
Primary applications areas are in the field of Tribology Science and Research, particularly with regards process and analysis results. For example co-efficient of friction monitoring (CoF).
The Tribo chemical mechanical polishing system is also readily adaptable as an enabling technology in Microelectromechanical Systems (MEMS) fabrication, particularly polysilicon surface micromachining, Opto-MEMS and Bio-MEMS packaging, assembly and even fabrication.
Advances in communication technology have led to the development of a wide variety of optoelectronics and integrated optics devices for applications such as; dense wavelength division multiplexing (DWDM), optical isolators, signal processors and optical switching.
Logitech has a large selection of adaptable systems for the preparation of optoelectronic materials such as; silicon, lithium niobate, lithium tantalate, bismuith silicon oxide, barium titanate and similar materials.
Our systems, accessories and consumables provide defect free face and edge polishing on optoelectronic substrate and scratch free surfaces with exacting and repeatable dimensional tolerances.
The importance of optical polishing and the processing of optical components has never been greater with the ongoing development of the telecommunications market. Whether for Infra Red and polymer waveguide production or fibre optic cable polishing.
The precision design and manufacture of our equipment enable you to obtain maximum results from the cutting, lapping and polishing of these optical materials.
Logitech systems are used by organisations across the world for many different complex sample preparation processes.
Including the thin section preparation of; Teeth, Bone, Otoliths, Ceramics, Metals, Alloys, Polymers and other Carbon-based materials.
The Logitech range of lapping plates provides a comprehensive selection for lapping of a wide range of materials.
The Logitech range of polishing plates provides a comprehensive selection for polishing a wide range of materials.
Abrasive autofeed cylinder for use with a Logitech PM5 or LP50 system. Cyclinders are also available in a sodium hypochlorite resistant material, for use with Chemical Mechanical Polishing applications.
Logitech supply weights and pressure blocks for use with Logitech lapping systems.
We supply a range of cast iron and glass test blocks as well as cast iron, glass and diamond conditioners for your lapping applications.
Logitech EP1 and EP2 Chemical Mechanical Polishing (CMP) Polishing Cloths and pads are suitable for a wide range of applications. Including oxide, nitride and copper.
Logitech Geochem Polishing Cloths are ideal for geological or semiconductor III-V material polishing.
Logitech IC1000 pads and Suba felts are specifically designed for stock and intermediate polishing where achieving a high precision surface is critical. They can be used across a wide range of materials including; GaAs, silicon, glass, metals, quartz, ceramics, copper and diamond thin film.
Calcined Aluminium Oxide powders for lapping and polishing hard materials.
For use in high precision lapping and polishing operations. Available in a wide range of grit sizes.
Fused Alumium Oxide powders for precision lapping and optical polishing operations.
Logitech glass carrier discs are used for the temporary support of both semiconductor and opto-electronics wafers during thinning and polishing operations.
Logitech cleaning fluids and powders and non-solvent based. They are suitable for most sample and substrate cleaning applications, including demounting of ultra-thin semiconductor wafers.