Visit Logitech at SEMICON China 2021 from the 15-17 of June, Shanghai, China. Find us at Booth 5775 where our technical experts will be on hand to provide information on our wide range of precision materials processing equipment.
Semiconductor device development and production is fundamentally driven by cost and quality. Our precision materials system solutions are designed to boost throughput levels with enhanced wafer quality in wafer fabrication R&D.
SEMICON China gives us the opportunity to showcase our highly automated equipment within a world-class electronics manufacturing hub and gives us the perfect opportunity to present our wide range of materials processing equipment to our customers in Asia. This year we will again be showcasing our newest addition to our precision lapping and polishing equipment range, the LP70 Multi-station Precision Lapping & Polishing System, along side the Logitech CMP Tribo designed specifically for CMP processing and our Wafer Substrate Bonding Unit (WSBU) designed for the safe bonding of fragile semiconductor wafers.
Arrange a meeting with our local Logitech representative’s at Logitech China by using the ‘Create a Meeting’ function at the top of the page – alternatively drop by Booth 5775 to see the systems, learn their process capabilities and learn how they can help boost the quality and throughput levels of your wafer fabrication activities.
If you are unable to attend SEMICON China you can contact us directly.