Extranet Login

t: +44 (0)1389 875444|e:enquiries@logitech.uk.com

  • Who we are
    • Our History
    • Quality & Accreditations
    • Our Environmental Policies
      • Our WEEE Policy
    • Careers
  • What we offer
    • By application
      • Semiconductors
      • Geological Sciences
      • Optoelectronics
      • Optics
      • Other applications
    • By material
      • Silicon
      • Silicon Carbide
      • Sapphire
      • Gallium Arsenide
      • Cadmium Zinc Telluride
      • Indium Phosphide
      • Rock/Soil
      • Other Materials
  • Products & Solutions
    • Lapping & Polishing
    • Chemical Polishing & Chemical Mechanical Polishing
    • Driven Head Lapping & Polishing Tools
    • Bonding & Impregnation Units
    • Test & Measurement
    • Cutting & Sawing
    • Accessories
    • Consumable Items
    • Consumables Store
  • Knowledge base
    • Whitepapers
    • Tech Files – Blog
    • Technology Transfer Programme
    • Brochures
    • Application Process Notes
    • Case Studies
    • FAQ
  • News & Events
    • News
    • Events
  • Contact
    • How to find us
    • Global Distributors
    • Equipment Returns
Menu
  • Who we are
    • Our History
    • Quality & Accreditations
    • Our Environmental Policies
      • Our WEEE Policy
    • Careers
  • What we offer
    • By application
      • Semiconductors
      • Geological Sciences
      • Optoelectronics
      • Optics
      • Other applications
    • By material
      • Silicon
      • Silicon Carbide
      • Sapphire
      • Gallium Arsenide
      • Cadmium Zinc Telluride
      • Indium Phosphide
      • Rock/Soil
      • Other Materials
  • Products & Solutions
    • Lapping & Polishing
    • Chemical Polishing & Chemical Mechanical Polishing
    • Driven Head Lapping & Polishing Tools
    • Bonding & Impregnation Units
    • Test & Measurement
    • Cutting & Sawing
    • Accessories
    • Consumable Items
    • Consumables Store
  • Knowledge base
    • Whitepapers
    • Tech Files – Blog
    • Technology Transfer Programme
    • Brochures
    • Application Process Notes
    • Case Studies
    • FAQ
  • News & Events
    • News
    • Events
  • Contact
    • How to find us
    • Global Distributors
    • Equipment Returns
Home  /  Test & Measurement  /  Vacuum Unit

Vacuum Unit

Categories: Test & Measurement, View All
  • Vacuum Unit
  • Vacuum Unit
  • Description
  • Facilities Requirement
  • Applications
  • Accessories & Consumables

Description

The versatile VS2 unit provides a ‘ready to use’ system for vacuum retention of samples on lapping and polishing jigs such as, the PLJ2 and PP5, vacuum chuck mounting blocks and the Logitech GTS1 Precision Saw.

Incorporating both a vacuum pump and water trap, the VS2 unit can effectively prevent water and slurry ingress into the vacuum supply of the jig or saw. Samples are therefore effectively safeguarded from any disruption to vacuum supply.

The VS2 is designed for both wall or bench mounting.

Visit our Online Consumables store

Download Brochure

Key Features

  • Single stage rotary vacuum pump
  • Water trap
  • Drain and control valves
  • Single frame construction
  • Bench or wall mounted

Product Specification:

Max Displacement, swept volume (240V/50Hz):  2.7m³h-¹
Max Displacement, swept volume (110V/60Hz): 3.24m³h-¹
Speed 240V: 2.3m³h-¹
Speed 110V: 2.7m³h-¹
Motor Power 240V/110V: 0.18kW
Ultimate Vacuum: 6 mbar
Max. Water Vapour Inlet Pressure: 25 mbar
Max. Water Vapour Pump Rate: 0.045 kg h-¹
Weight: 12.5kg
Dimensions (excluding pump): 755mm x 310mm x 220mm
Weight (excluding pump): 4kg

 

 

Geological Sciences

geologicalsciences

In many areas of geological study such as mineralogy, petrography and sedimentology you are required to analyse the characteristics of the materials such as soil or rock. To be able to do this a thin section needs to be prepared for microscopic examination.

Logitech precision equipment is ideal for thin or ultra-thin section preparation. Our wide range of versatile systems enable you to trim, lap and polish geological thin sections such as rock, coal, concete and soils.

Each of our systems are fully supported by a wide range of accessories and consumables, such as abrasive powders, polishing cloths and mounting media.

Optoelectronics

optoelectronics

Advances in communication technology have led to the development of a wide variety of optoelectronics and integrated optics devices for applications such as; dense wavelength division multiplexing (DWDM), optical isolators, signal processors and optical switching.

Logitech has a large selection of adaptable systems for the preparation of optoelectronic materials such as; silicon, lithium niobate, lithium tantalate, bismuith silicon oxide, barium titanate and similar materials.

Our systems, accessories and consumables provide defect free face and edge polishing on optoelectronic substrate and scratch free surfaces with exacting and repeatable dimensional tolerances.

Optics

optics

The importance of optical polishing and the processing of optical components has never been greater with the ongoing development of the telecommunications market. Whether for Infra Red and polymer waveguide production or fibre optic cable polishing.

The precision design and manufacture of our equipment enable you to obtain maximum results from the cutting, lapping and polishing of these optical materials.

Semiconductors

semiconductors

Semiconductor materials are used in a wide variety of devices such as field effect transistors (MosFets, Fets), integrated circuits (ICs, MMICs, ASICs), focal plane arrays and infra-red detectors.

Whatever the application or material, each semiconductor wafer undergoes several common stages during manufacture, which include slicing the wafer from the crystal, preparing the surface prior to fabrication and thinning the device after fabrication through the use of lapping and polishing techniques.

Logitech provide complete system solutions including consumables for the precise thinning of these III-V, I.R. and similar materials.

Ultragrade 19 Vacuum Oil

High performance lubricant oil for vacuum pumps and mechanical systems.

the-tech-files

Expert news and views to help sharpen your cutting edge

DIAMONDS ARE AN ENGINEER’S BEST FRIEND

In recent years, diamond has emerged as not only a girl’s best friend, but also as contender as an engineer’s best friend – if the technical challenges of exploiting its remarkable properties can be overcome.

LOGIN TO VIEW

THE END OF THE CHIP FOR SILICON?

Silicon-based semiconducting integrated circuits have changed the world immeasurably over the past 50 years. Today the number of silicon chips in use far outweighs the number of humans currently alive.

LOGIN TO VIEW

OPTIMAL FRICTION FOR OPTIMAL FLATNESS

The wafers used to make semiconducting chips for electronic devices all have one thing in common – they need to be smooth – super smooth. Typically, wafer flatness needs to be controlled within ±2 μm.

FREE TO VIEW
contact-us-icon
contact-us-icon
contact-us-icon

Home  |  Sitemap  |  Privacy Policy  | Cookies Policy | Environmental Policy | Contact Us  |  Extranet | Indicor

We are using cookies to give you the best experience on our website.

You can find out more about which cookies we are using or switch them off in .

Powered by  GDPR Cookie Compliance
Privacy Overview

This website uses cookies so that we can provide you with the best user experience possible. Cookie information is stored in your browser and performs functions such as recognising you when you return to our website and helping our team to understand which sections of the website you find most interesting and useful.

Strictly Necessary Cookies

Strictly Necessary Cookie should be enabled at all times so that we can save your preferences for cookie settings.

If you disable this cookie, we will not be able to save your preferences. This means that every time you visit this website you will need to enable or disable cookies again.