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PM6 Precision Lapping & Polishing System

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Description

The PM6 Precision Lapping & Polishing system produces results typically found on production scale equipment. Highly flexible in use, the PM6 allows users to work with many different materials including; gallium arsenide, silicon, rock and soils. This system provides the ability to produce specimens repeatably with superior quality and surface
finish. Precise plate set-up options combined with an intuitive control system provide an effortless consistency of results with a very high degree of accuracy.

Wherever there is a need for a controlled flat surface with a high quality finish the PM6 makes an invaluable investment. The PM6 system offers enhanced process performance through a combination of innovative designs and intuitive operator
controls.

Single workstation with a wafer process capacity of up to 4”/100mm – driven jig roller arms greatly increases accuracy and repeatability.
Plate speeds of between 5 and 100rpm, which facilitates faster lapping and polishing rates.
The recipe mode feature allows operators to create, save and re-call multi-stage process recipes.
The metered abrasive feed unit, via the peristaltic pumps, allows operators to set the flow rate of between 1-100ml per minute. This greatly increases the quality and the accuracy of results, while reducing both wastage and operational costs.
Customers are achieving increased material removal rates (MRR), with far greater control, compared to similar systems without metered abrasive delivery or a driven-jig-arm functionality.
All process conditions are controlled via the Graphical User Interface (GUI), including: plate speeds, material removal rates, driven jig arm, the metered abrasive feed – giving the operator complete control.
The automatic drip detector will stop the plate rotating when the abrasive cylinders are empty – thereby avoiding any damage to the specimen running on a dry plate.
Real time data collection and feedback via Bluetooth to allow users to export information via the USB port for external analysis.
Bluetooth automatic-plate-flatness control provides continuous in-situ measurement of the plate flatness.

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Key Features

Process up to 100mm/4″ wafers
Up to 100rpm plate speed facilitating faster lapping rates
Driven jig roller arm with linear sweep
Bluetooth enabled features
Automatic plate flatness control

Customer Review

“There have been a lot of new and used machines I have operated before. The PM6 is first machine on which we can actually start producing real parts after 4 days of training. When we were expanding our business, I did not think about anyone else, I called Logitech.”

Guofeng Pang – Senior Developer, Engineer

Additional information

video	https://youtu.be/NZ7aTx4hOOw

Power Supply	220-240v 10A 110v 10A 50-60HZ
Jig type	PP5(x1) PP6(x1)
Plate speed	5-100 rpm
Plate sizes (diameter)	300mm
Height (including extraction port)	915mm 965mm
Depth	720mm
Width	802mm
Mass (Excluding cylinders etc)	127kg
Plate Flatness Monitor (Bluetooth enabled)	0.1 Micron Resolution
Abrasive Delivery	Up to 2x 2L Cylinders, Measured flow Peristaltic pump 1-100ml/min
Colloidal Delivery	Peristaltic pump 1-100ml/min

Geological Sciences

In many areas of geological study such as mineralogy, petrography and sedimentology you are required to analyse the characteristics of the materials such as soil or rock. To be able to do this a thin section needs to be prepared for microscopic examination.

Logitech precision equipment is ideal for thin or ultra-thin section preparation. Our wide range of versatile systems enable you to trim, lap and polish geological thin sections such as rock, coal, concete and soils.

Each of our systems are fully supported by a wide range of accessories and consumables, such as abrasive powders, polishing cloths and mounting media.

Semiconductors

Semiconductor materials are used in a wide variety of devices such as field effect transistors (MosFets, Fets), integrated circuits (ICs, MMICs, ASICs), focal plane arrays and infra-red detectors.

Whatever the application or material, each semiconductor wafer undergoes several common stages during manufacture, which include slicing the wafer from the crystal, preparing the surface prior to fabrication and thinning the device after fabrication through the use of lapping and polishing techniques.

Logitech provide complete system solutions including consumables for the precise thinning of these III-V, I.R. and similar materials.

CMP Applications

Primary applications areas are in the field of Tribology Science and Research, particularly with regards process and analysis results. For example co-efficient of friction monitoring (CoF).

The Tribo chemical mechanical polishing system is also readily adaptable as an enabling technology in Microelectromechanical Systems (MEMS) fabrication, particularly polysilicon surface micromachining, Opto-MEMS and Bio-MEMS packaging, assembly and even fabrication.

Optoelectronics

Advances in communication technology have led to the development of a wide variety of optoelectronics and integrated optics devices for applications such as; dense wavelength division multiplexing (DWDM), optical isolators, signal processors and optical switching.

Logitech has a large selection of adaptable systems for the preparation of optoelectronic materials such as; silicon, lithium niobate, lithium tantalate, bismuith silicon oxide, barium titanate and similar materials.

Our systems, accessories and consumables provide defect free face and edge polishing on optoelectronic substrate and scratch free surfaces with exacting and repeatable dimensional tolerances.

Optics

The importance of optical polishing and the processing of optical components has never been greater with the ongoing development of the telecommunications market. Whether for Infra Red and polymer waveguide production or fibre optic cable polishing.

The precision design and manufacture of our equipment enable you to obtain maximum results from the cutting, lapping and polishing of these optical materials.

Other Applications

Logitech systems are used by organisations across the world for many different complex sample preparation processes.

Including the thin section preparation of; Teeth, Bone, Otoliths, Ceramics, Metals, Alloys, Polymers and other Carbon-based materials.

Lapping Plates

The Logitech range of lapping plates provides a comprehensive selection for lapping of a wide range of materials.

Polishing Plates

The Logitech range of polishing plates provides a comprehensive selection for polishing a wide range of materials.

Abrasive Autofeed Cylinder

Abrasive autofeed cylinder for use with a Logitech PM5 or LP50 system. Cyclinders are also available in a sodium hypochlorite resistant material, for use with Chemical Mechanical Polishing applications.

Weights and Pressure Blocks

Logitech supply weights and pressure blocks for use with Logitech lapping systems.

Conditioners/Test Blocks

We supply a range of cast iron and glass test blocks as well as cast iron, glass and diamond conditioners for your lapping applications.

EP Polishing Pads and Cloths

Logitech EP1 and EP2 Chemical Mechanical Polishing (CMP) Polishing Cloths and pads are suitable for a wide range of applications. Including oxide, nitride and copper.

Geochem Polishing Cloths

Logitech Geochem Polishing Cloths are ideal for geological or semiconductor III-V material polishing.

IC1000 & Suba Polishing Pads and Cloths

Logitech IC1000 pads and Suba felts are specifically designed for stock and intermediate polishing where achieving a high precision surface is critical. They can be used across a wide range of materials including; GaAs, silicon, glass, metals, quartz, ceramics, copper and diamond thin film.

Aluminium Oxide Powder

Calcined Aluminium Oxide powders for lapping and polishing hard materials.

Silicon Carbide Powders

For use in high precision lapping and polishing operations. Available in a wide range of grit sizes.

Fused Aluminium Oxide Powder

Fused Alumium Oxide powders for precision lapping and optical polishing operations.

Carrier Disc & Substrates

Logitech glass carrier discs are used for the temporary support of both semiconductor and opto-electronics wafers during thinning and polishing operations.

Cleaning Fluids & Powders

Logitech cleaning fluids and powders and non-solvent based. They are suitable for most sample and substrate cleaning applications, including demounting of ultra-thin semiconductor wafers.

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