Last month, Logitech was delighted to present at the Geological Materials Symposium at the University of Durham. This was Logitech’s third time attending the event, and made for an excellent day, surrounded by manufacturers, Geo Technicians, and academics from the UK and further afield in attendance.
While there, technical experts at Logitech presented a step-by-step guide to the perfect preparation of geological thin sections using the LP70 lapping and polishing system.
The LP70 is the latest addition to the intelligent range of highly automated lapping and polishing systems, featuring four workstations, each with a wafer process capacity of up to 100mm/4″, and driven jig roller arm technology, which greatly increases accuracy and repeatability.
To learn more about the full functionality and process capabilities of the LP70, please visit the LP70 product page here.