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DL81/82 Lapping and Polishing System

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Description

The DL81 and DL82 are high-precision lapping and polishing systems, with the DL82 featuring two automatic workstations and the DL81 combining one automatic and one manual station. They support 700 mm plates and two precision air jigs, handling samples up to 8” (200 mm) jig-held or 12” (300 mm) free lapped. Adjustable air jigs (2–40 kg, 47 kg option) are software-controlled, with in-situ load cells for automatic calibration. Bluetooth-enabled plate flatness control and real-time thickness feedback ensure precision.

An automated jig handling system prevents over-processing, while a service hoist supports safe plate and jig handling. A 15” touch-screen with USB data extraction simplifies operation. Multi-stage processing is enabled by four 3.8 L cylinders, and the metered abrasive feed system (5-100 ml/min) improves efficiency. The sealed enclosure supports hazardous material processing, with an exhaust port for extraction. Real-time monitoring, recipe mode, EtherCAT diagnostics, and a traffic light status tower enhance control and repeatability.

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Key Features

Flexible Configurations – DL82 (two automatic) or DL81 (one automatic, one manual), supporting 700 mm plates and two air jigs with Bluetooth flatness control and real-time thickness feedback.
Advanced Jig Handling – Adjustable air jigs (2–40 kg, 47 kg option) with automated lifting and inversion to prevent over-processing. In-situ load cells ensure precise calibration.
Optimized Processing – Multi-stage lapping/polishing with four 3.8 L cylinders and a metered abrasive feed (5-100 ml/min). Sealed system with exhaust port for safe hazardous material handling.
Smart Control & Monitoring – 15” touch-screen, USB data extraction, real-time monitoring, and recipe mode for repeatability. EtherCAT diagnostics and traffic light alerts enhance oversight.

Jig Capacity DL81	1 x Air Jig – up to 8″/200 mm capacity
Jig Capacity DL82	2 x Air Jigs simultaneously – each up to 8″/200 mm capacity
Jig Options	2AJ200 – 8″/200 mm \| AJ150 – 6″/150 mm \| AJ100 – 4″/100 mm
Jig speed	100 rpm
Height	1975 mm
Jig Load Range	2-40 kg
Width	1639 mm
Depth	1141 mm
Power Supply	Single Phase, Earth ac. 220-240V 32 Amps
Plate Diameter	Up to 700 mm
Plate Speed	100 rpm
Plate Speed	CCW
Slurry Flow Rate	CCW
Wafer Sizes	2”, 3”, 4”, 6” and 8” single
Exhaust Port	150 mm OD
Slurry Waste	Logiwaste Integrated Sealed System

Optoelectronics

Semiconductor materials are used in a wide variety of devices such as field effect transistors (MosFets, Fets), integrated circuits (ICs, MMICs, ASICs), focal plane arrays and infra-red detectors.

Whatever the application or material, each semiconductor wafer undergoes several common stages during manufacture, which include slicing the wafer from the crystal, preparing the surface prior to fabrication and thinning the device after fabrication through the use of lapping and polishing techniques.

Logitech provide complete system solutions including consumables for the precise thinning of these III-V, I.R. and similar materials.

Optoelectronics

Advances in communication technology have led to the development of a wide variety of optoelectronics and integrated optics devices for applications such as; dense wavelength division multiplexing (DWDM), optical isolators, signal processors and optical switching.

Logitech has a large selection of adaptable systems for the preparation of optoelectronic materials such as; silicon, lithium niobate, lithium tantalate, bismuith silicon oxide, barium titanate and similar materials.

Our systems, accessories and consumables provide defect free face and edge polishing on optoelectronic substrate and scratch free surfaces with exacting and repeatable dimensional tolerances.

Optics

The importance of optical polishing and the processing of optical components has never been greater with the ongoing development of the telecommunications market. Whether for Infra Red and polymer waveguide production or fibre optic cable polishing.

The precision design and manufacture of our equipment enable you to obtain maximum results from the cutting, lapping and polishing of these optical materials.

Lapping Plates

The Logitech range of lapping plates provides a comprehensive selection for lapping of a wide range of materials.

Polishing Plates

The Logitech range of polishing plates provides a comprehensive selection for polishing a wide range of materials.

Aluminium Oxide Powder

Calcined Aluminium Oxide powders for lapping and polishing hard materials.

Silicon Carbide Powders

For use in high precision lapping and polishing operations. Available in a wide range of grit sizes.

Aluminium Oxide Powder

Fused Alumium Oxide powders for precision lapping and optical polishing operations.

Boron Carbide Lapping Powder

Boron Carbide is used for the processing of ceramics, sapphire, heat treated alloys and very hard minerals.

Cerium Oxide Polishing Powder

Rare earth polishing media for the final polishing of materials to “optical” polishing standards.

Chemcloth Polishing Cloths

Logitech Chemcloth Polishing Cloths are designed to meet the needs of today’s (Chemical Mechanical Polishing (CMP) operations.

EP Polishing Pads and Cloths

Logitech EP1 and EP2 Chemical Mechanical Polishing (CMP) Polishing Cloths and pads are suitable for a wide range of applications. Including oxide, nitride and copper.

Polishing Suspensions

Logitech polishing suspensions have been developed to suit a wide range of polishing applications in the semiconductor and optoelectronics industries.

Polishing Carrier Fluids

Logitech polishing carrier fluids contain excellent properties to assist the polishing process of water soluble materials.

IC1000 & Suba Polishing Pads and Cloths

Logitech IC1000 pads and Suba felts are specifically designed for stock and intermediate polishing where achieving a high precision surface is critical. They can be used across a wide range of materials including; GaAs, silicon, glass, metals, quartz, ceramics, copper and diamond thin film.

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