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Vacuum Chuck Mounting Blocks

Category: Accessories

Description

Logitech’s Vacuum Chuck Mounting Blocks provide an ideal means of holding specimens for polishing operations, where no thickness control or angular adjustment is required.

The VCB2 and VCB7 are precisely engineered vacuum chucking facilities. A choice of chuck face patterns enable slide mounted samples or wafer material to be held securely by vacuum.

To obtain control of polishing speed across different material types and with different polishing media, nine 0.35kg loading weights are supplied with the jig (0.47kg for VCB7). An additional 3.5kg weight can be used if required.

The VCB2 is available with a number of different chuck face patterns and accomodates samples of up to 100mm in diameter. 100 x 75mm or more smaller samples.

The VCB7 is a larger version which can hold large format geological thin sections (150x100mm), or a large number of smaller slides for polishing. It will also accommodate 150mm diameter semiconductor wafers.

The sample is held on the chuck face by a vacuum, which permits ease and speed of mounting and demounting the sample. The vacuum is fed to the chuckface by means of a vacuum tube in the middle of the jig. A rotary vacuum adaptor sits on top of this tube ensuring that the jig is always free to turn, providing a smooth polishing action.

Key Features

Vacuum chuck sample location
Variable additional load of up to 8kg
Suitable for thin section polishing
Suitable for wafer planarization

Applications:
Vacuum Chuck Mounting Blocks are excellent for polishing thin sections, including soils, coals, palaentological specimens, rocks, concretes, and cements.

They are also ideal for wafer planarization in which a small amount of material is polished from partially or fully fabricated wafers to remove surface irregularity.

Slide Capacity:

Sample Size:	VCB2	VCB7
28 x 48mm	6	14
30 x 45mm	6	9
25 x 75mm	4	10
45 x 60mm	3	5
50 x 75mm	2	4
60 x 90mm	1	2
75 x 110mm	1	–
100 x 150mm	–	1
25mm Dia	8	–
100mm Dia	1	–
150mm Dia	–	1

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Slide Capacity:

Sample Size:	VCB2	VCB7
28 x 48mm	6	14
30 x 45mm	6	9
25 x 75mm	4	10
45 x 60mm	3	5
50 x 75mm	2	4
60 x 90mm	1	2
75 x 110mm	1	–
100 x 150mm	–	1
25mm Dia	8	–
100mm Dia	1	–
150mm Dia	–	1

Geological Sciences

In many areas of geological study such as mineralogy, petrography and sedimentology you are required to analyse the characteristics of the materials such as soil or rock. To be able to do this a thin section needs to be prepared for microscopic examination.

Logitech precision equipment is ideal for thin or ultra-thin section preparation. Our wide range of versatile systems enable you to trim, lap and polish geological thin sections such as rock, coal, concete and soils.

Each of our systems are fully supported by a wide range of accessories and consumables, such as abrasive powders, polishing cloths and mounting media.

Semiconductors

Semiconductor materials are used in a wide variety of devices such as field effect transistors (MosFets, Fets), integrated circuits (ICs, MMICs, ASICs), focal plane arrays and infra-red detectors.

Whatever the application or material, each semiconductor wafer undergoes several common stages during manufacture, which include slicing the wafer from the crystal, preparing the surface prior to fabrication and thinning the device after fabrication through the use of lapping and polishing techniques.

Logitech provide complete system solutions including consumables for the precise thinning of these III-V, I.R. and similar materials.

Optoelectronics

Advances in communication technology have led to the development of a wide variety of optoelectronics and integrated optics devices for applications such as; dense wavelength division multiplexing (DWDM), optical isolators, signal processors and optical switching.

Logitech has a large selection of adaptable systems for the preparation of optoelectronic materials such as; silicon, lithium niobate, lithium tantalate, bismuith silicon oxide, barium titanate and similar materials.

Our systems, accessories and consumables provide defect free face and edge polishing on optoelectronic substrate and scratch free surfaces with exacting and repeatable dimensional tolerances.

Optics

The importance of optical polishing and the processing of optical components has never been greater with the ongoing development of the telecommunications market. Whether for Infra Red and polymer waveguide production or fibre optic cable polishing.

The precision design and manufacture of our equipment enable you to obtain maximum results from the cutting, lapping and polishing of these optical materials.

Other Applications

Logitech Material Processing Specialists

Logitech systems are used by organisations across the world for many different complex sample preparation processes.

Including the thin section preparation of; Teeth, Bone, Otoliths, Ceramics, Metals, Alloys, Polymers and other Carbon-based materials.

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