Logitech Ultra Fine Aluminium Oxide polishing powders are sub-micron powders. They are produced in a special process using the calcination of alum.
They are chemically inert, fast-cutting abrasives for a wide range of lapping and polishing plate types. The powder can be used in suspension, slurry or paste form by mixing with water.
Materials processing applications for Ultra Fine Aluminium Oxide powder includes:
- Optical components
- Ferrite components
- Metallographic micro sections
- Electro-optic materials
- Semiconductor wafers
Colour: White, tan or grey
Percentage Content: 95-99%
Boiling Point: 2980 °C
Melting Point: 2045°C
Solubility: Insoluble in water and solvents
- Ultra Fine Calcined Aluminium Oxide Powder, 0.3 micron, 2kg pack
- Ultra Fine Calcined Aluminium Oxide Powder, 0.05 micron, 2kg pack
- Ultra Fine Calcined Aluminium Oxide Powder, 1.0 micron, 2kg pack