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      • Indium Phosphide
      • Rock/Soil
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  • Products & Solutions
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    • Chemical Polishing & Chemical Mechanical Polishing
    • Driven Head Lapping & Polishing Tools
    • Bonding & Impregnation Units
    • Test & Measurement
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    • Accessories
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Home  /  Bonding & Impregnation Units  /  Solvent Vapour Cleaner

Solvent Vapour Cleaner

Categories: Bonding & Impregnation Units, View All
  • Description
  • Facilities Requirement
  • Applications
  • Accessories & Consumables

Description

The Logitech Solvent/Vapour Cleaner is the ideal tool for the effective and rapid dissolving and cleaning of temporary wax bonds. Temporary wax bonds tend to be used to temporarily bond samples together or on to a support substrate prior to processing. The unit may be used with samples of up to 4″ in diameter with a wide variety of materials including; Gallium Arsenide (GaAs), Indium Phosphide (InP), Silicon (Si), Ceramics and much more.

It is particularly suited to demounting semiconductor wafers, such as GaAs, InP and Si. In addition, provides an ideal solution to the problems of de-bonding and cleaning stacks of opto-electronic materials such as Lithium Niobate or Lithium Tantalate.

During the operation, the cleaning solution is heated in the bottom section of the cleaner (it is recommended that alcohol such as Iso-propanol (2-Propanol, IPA) for best results), it is then cooled resulting in only clean IPA vapour rising and condensing on the surface of the bonded sample.

During the operation the cleaner emits solvent fumes so therefore must be used in conjunction with a fume extractor unit such as the Logitech Duct Free Fume Cabinet.

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Key Features

  • Ideal tool for the effective and rapid dissolving and cleaning of temporary wax bonds.
  • May be used with samples of up to 4″ in diameter.
  • Ideally suited to demounting semiconductor wafers such as GaAs, InP and Si.
  • Ideal solution for the problem of de-bonding and cleaning stacks of opto-electronic materials such as Lithium Niobate or Lithium Tantalate.
  • Can be used as part of a two-stage demounting process alongside Logitech’s Ecoclear non-solvent cleaning fluid.

Product Specifications:

Power Supply: 1ACCS-5100 – 220v-240v, 50Hz, 750W

1ACCS-5150 – 110v, 50/60Hz, 750W

Chamber Size: 4ltr Beaker
Shipping Weight:  9.07kg (20lb)
Complete Height: 501.6mm (19.75″)

Semiconductors

semiconductors

Semiconductor materials are used in a wide variety of devices such as field effect transistors (MosFets, Fets), integrated circuits (ICs, MMICs, ASICs), focal plane arrays and infra-red detectors.

Whatever the application or material, each semiconductor wafer undergoes several common stages during manufacture, which include slicing the wafer from the crystal, preparing the surface prior to fabrication and thinning the device after fabrication through the use of lapping and polishing techniques.

Logitech provide complete system solutions including consumables for the precise thinning of these III-V, I.R. and similar materials.

Optoelectronics

optoelectronics

Advances in communication technology have led to the development of a wide variety of optoelectronics and integrated optics devices for applications such as; dense wavelength division multiplexing (DWDM), optical isolators, signal processors and optical switching.

Logitech has a large selection of adaptable systems for the preparation of optoelectronic materials such as; silicon, lithium niobate, lithium tantalate, bismuith silicon oxide, barium titanate and similar materials.

Our systems, accessories and consumables provide defect free face and edge polishing on optoelectronic substrate and scratch free surfaces with exacting and repeatable dimensional tolerances.

Optics

optics

The importance of optical polishing and the processing of optical components has never been greater with the ongoing development of the telecommunications market. Whether for Infra Red and polymer waveguide production or fibre optic cable polishing.

The precision design and manufacture of our equipment enable you to obtain maximum results from the cutting, lapping and polishing of these optical materials.

Logitech Ecoclear Non-Solvent Cleaning Fluid

For use in a two-stage demounting process where the sample is soaked in Ecoclear to dissolve the wax bonds and finally used within the Solvent Vapour Cleaner with IPA to remove any surface residue that may remain.

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