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SILICON CARBIDE POWDER

Description
Applications

Description

Logitech Silicon Carbide Powders are manufactured for use in high precision lapping and polishing operations. Supplied in a wide range of grit sizes, these high quality abrasive powders can be used where repeatability of material removal rate is required.

Typical applications include:

Thin rock section production
Silicon wafer backthinning
Processing of ferrites and other ceramic components
Calcified tissue thin section preparation

Typical Chemical Analysis:

Silicon Carbide: 97.60%
SiO2: 0.60%

Si: 0.80%

Fe: 0.20%

Al: 0.30%

Carbon: 0.50%

Magnetic Iron: 0.04%

Product Specification:

Colour: Dark Grey

pH: 6.8 – 7.2

Shape: Blocky, with sharp edges

Grading: FEPA 42-GB-1984

Bulk Density: FEPA 44-GB-1986

Surface Chemistry: FEPA 42-GB-1984

Knoop 100 Hard No: 2480

Specific Gravity: 3.2g/cc

Crystal Structure: Hexagonal

Fracture: Conchoidal

Order Options:

Silicon Carbide Powder, 1200 Grit, 5kg pack
Silicon Carbide Powder, 1000 Grit, 5kg pack
Silicon Carbide Powder, 600 Grit, 5kg pack.
Silicon Carbide Powder, 400 Grit, 5kg pack
Silicon Carbide Powder, 320 Grit, 5kg pack
Silicon Carbide Powder, 240 Grit, 5kg pack

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Semiconductors	Semiconductor materials are used in a wide variety of devices such as field effect transistors (MosFets, Fets), integrated circuits (ICs, MMICs, ASICs), focal plane arrays and infra-red detectors. Whatever the application or material, each semiconductor wafer undergoes several common stages during manufacture, which include slicing the wafer from the crystal, preparing the surface prior to fabrication and thinning the device after fabrication through the use of lapping and polishing techniques. Logitech provide complete system solutions including consumables for the precise thinning of these III-V, I.R. and similar materials.
Geological Sciences	In many areas of geological study such as mineralogy, petrography and sedimentology you are required to analyse the characteristics of the materials such as soil or rock. To be able to do this a thin section needs to be prepared for microscopic examination. Logitech precision equipment is ideal for thin or ultra-thin section preparation. Our wide range of versatile systems enable you to trim, lap and polish geological thin sections such as rock, coal, concete and soils. Each of our systems are fully supported by a wide range of accessories and consumables, such as abrasive powders, polishing cloths and mounting media.
Other Applications	Logitech systems are used by organisations across the world for many different complex sample preparation processes. Including the thin section preparation of; Teeth, Bone, Otoliths, Ceramics, Metals, Alloys, Polymers and other Carbon-based materials.

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