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Menu
  • Who we are
    • Our History
    • Quality & Accreditations
    • Our Environmental Policies
      • Our WEEE Policy
    • Careers
  • What we offer
    • By application
      • Semiconductors
      • Geological Sciences
      • Optoelectronics
      • Optics
      • Other applications
    • By material
      • Silicon
      • Silicon Carbide
      • Sapphire
      • Gallium Arsenide
      • Cadmium Zinc Telluride
      • Indium Phosphide
      • Rock/Soil
      • Other Materials
  • Products & Solutions
    • Lapping & Polishing
    • Chemical Polishing & Chemical Mechanical Polishing
    • Driven Head Lapping & Polishing Tools
    • Bonding & Impregnation Units
    • Test & Measurement
    • Cutting & Sawing
    • Accessories
    • Consumable Items
    • Consumables Store
  • Knowledge base
    • Whitepapers
    • Tech Files – Blog
    • Technology Transfer Programme
    • Brochures
    • Application Process Notes
    • Case Studies
    • FAQ
  • News & Events
    • News
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    • How to find us
    • Global Distributors
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Home  /  Accessories  /  Polishing Plates

Polishing Plates

Category: Accessories
  • Polishing Plates
  • Description
  • Applications
  • Accessories & Consumables

Description

Key Features
  • Large selection of polishing plates available

The Logitech range of polishing plates, pads and cloths provides a comprehensive selection for polishing of a wide range of materials.

All of our plates are designed to provide optimum surface finish whilst maximising the plate lifespan.

Product Data:

Plate Size: Product Code:   Material: Groove: Description: System Compatability
300mm (12″) 1PL31-0100 NaCIO Resistant – Plain plate base for use with Sodium Hypochlorite PM5/PM6
350mm (14″) 1PL34-0100 NaCIO Resistant – Plain plate base for use with Sodium Hypochlorite LP50
300mm (12″) 1PL41-0100 – – Plain plate base. PM5/PM6
350mm (14″) 1PL44-0100 – – Plain plate base. LP50
300mm (12″) 1PLA3-0300 – – Plate Cover PM5/PM6
350mm (14″) 1PLA4-0100 – – Plate Cover LP50

Visit our Online Consumables store

Geological Sciences

Geological Sciences Applications

In many areas of geological study such as mineralogy, petrography and sedimentology you are required to analyse the characteristics of the materials such as soil or rock. To be able to do this a thin section needs to be prepared for microscopic examination.

Logitech precision equipment is ideal for thin or ultra-thin section preparation. Our wide range of versatile systems enable you to trim, lap and polish geological thin sections such as rock, coal, concete and soils.

Each of our systems are fully supported by a wide range of accessories and consumables, such as abrasive powders, polishing cloths and mounting media.

Semiconductors

Semiconductor Applications

Semiconductor materials are used in a wide variety of devices such as field effect transistors (MosFets, Fets), integrated circuits (ICs, MMICs, ASICs), focal plane arrays and infra-red detectors.

Whatever the application or material, each semiconductor wafer undergoes several common stages during manufacture, which include slicing the wafer from the crystal, preparing the surface prior to fabrication and thinning the device after fabrication through the use of lapping and polishing techniques.

Logitech provide complete system solutions including consumables for the precise thinning of these III-V, I.R. and similar materials.

Optoelectronics

Logitech Optoelectronic Material Processing Systems

Advances in communication technology have led to the development of a wide variety of optoelectronics and integrated optics devices for applications such as; dense wavelength division multiplexing (DWDM), optical isolators, signal processors and optical switching.

Logitech has a large selection of adaptable systems for the preparation of optoelectronic materials such as; silicon, lithium niobate, lithium tantalate, bismuith silicon oxide, barium titanate and similar materials.

Our systems, accessories and consumables provide defect free face and edge polishing on optoelectronic substrate and scratch free surfaces with exacting and repeatable dimensional tolerances.

Optics

Systems for Optical Material Applications

The importance of optical polishing and the processing of optical components has never been greater with the ongoing development of the telecommunications market. Whether for Infra Red and polymer waveguide production or fibre optic cable polishing.

The precision design and manufacture of our equipment enable you to obtain maximum results from the cutting, lapping and polishing of these optical materials.

Chemcloth Polishing Cloths

Logitech Chemcloth Polishing Cloths are designed to meet the needs of today’s (Chemical Mechanical Polishing (CMP) operations.

Polishing Carrier Fluids

Logitech polishing carrier fluids contain excellent properties to assist the polishing process of water soluble materials.

Polishing Suspensions

Logitech polishing suspensions have been developed to suit a wide range of polishing applications in the semiconductor and optoelectronics industries.

EP Polishing Pads and Cloths

Logitech EP1 and EP2 Chemical Mechanical Polishing (CMP) Polishing Cloths and pads are suitable for a wide range of applications.  Including oxide, nitride and copper.

Geochem Polishing Cloths

Logitech Geochem Polishing Cloths are ideal for geological or semiconductor III-V material polishing.

IC1000 & Suba Polishing Pads and Cloths

Logitech IC1000 pads and Suba felts are specifically designed for stock and intermediate polishing where achieving a high precision surface is critical.  They can be used across a wide range of materials including; GaAs, silicon, glass, metals, quartz, ceramics, copper and diamond thin film.

the-tech-files

Expert news and views to help sharpen your cutting edge

DIAMONDS ARE AN ENGINEER’S BEST FRIEND

In recent years, diamond has emerged as not only a girl’s best friend, but also as contender as an engineer’s best friend – if the technical challenges of exploiting its remarkable properties can be overcome.

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THE END OF THE CHIP FOR SILICON?

Silicon-based semiconducting integrated circuits have changed the world immeasurably over the past 50 years. Today the number of silicon chips in use far outweighs the number of humans currently alive.

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OPTIMAL FRICTION FOR OPTIMAL FLATNESS

The wafers used to make semiconducting chips for electronic devices all have one thing in common – they need to be smooth – super smooth. Typically, wafer flatness needs to be controlled within ±2 μm.

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