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  • Who we are
    • Our History
    • Quality & Accreditations
    • Our Environmental Policies
      • Our WEEE Policy
    • Careers
  • What we offer
    • By application
      • Semiconductors
      • Geological Sciences
      • Optoelectronics
      • Optics
      • Other applications
    • By material
      • Silicon
      • Silicon Carbide
      • Sapphire
      • Gallium Arsenide
      • Cadmium Zinc Telluride
      • Indium Phosphide
      • Rock/Soil
      • Other Materials
  • Products & Solutions
    • Lapping & Polishing
    • Chemical Polishing & Chemical Mechanical Polishing
    • Driven Head Lapping & Polishing Tools
    • Bonding & Impregnation Units
    • Test & Measurement
    • Cutting & Sawing
    • Accessories
    • Consumable Items
    • Consumables Store
  • Knowledge base
    • Whitepapers
    • Tech Files – Blog
    • Technology Transfer Programme
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Home  /  Consumables to Order  /  LOGIPOL HYPER DIAMOND SUSPENSION

LOGIPOL HYPER DIAMOND SUSPENSION

Category: Consumables to Order
  • Description

Description

  • LogiPol 1-3μm Hyper Diamond Suspension 1 ltr – LogiPol Hyper Diamond Suspension for polishing hard material substrates including Silicon Carbide/Silicon/Alumina/Ceramic
  • LogiPol 2-4μm Hyper Diamond Suspension 1 ltr – LogiPol Hyper Diamond Suspension for polishing hard material substrates including Silicon Carbide/Silicon/Alumina/Ceramic
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the-tech-files

Expert news and views to help sharpen your cutting edge

DIAMONDS ARE AN ENGINEER’S BEST FRIEND

In recent years, diamond has emerged as not only a girl’s best friend, but also as contender as an engineer’s best friend – if the technical challenges of exploiting its remarkable properties can be overcome.

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THE END OF THE CHIP FOR SILICON?

Silicon-based semiconducting integrated circuits have changed the world immeasurably over the past 50 years. Today the number of silicon chips in use far outweighs the number of humans currently alive.

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OPTIMAL FRICTION FOR OPTIMAL FLATNESS

The wafers used to make semiconducting chips for electronic devices all have one thing in common – they need to be smooth – super smooth. Typically, wafer flatness needs to be controlled within ±2 μm.

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