Description
The HPS is a fully equipped base unit featuring a robust cabinet, integrated power system, and pre-installed software in both Annular and Peripheral configurations. It offers customisation through five specialised saw kits, allowing tailoring for specific cutting needs such as precision dicing or wafering. Both configurations ensure high positional accuracy (10μm in the x and y axes) with minimal material wastage. A stepper motor-controlled x-y table provides smooth operation and optimal control of the sample’s movement, while a laser alignment tool, integrated with the goniometer, enables precise targeting of crystal boundaries and surface alignment. Coolant is efficiently delivered via a recirculation unit with a 25-liter tank, ensuring a constant flow rate and preventing damage during the cutting process.
Key Features – Peripheral
- Peripheral Configuration: Capable of dicing wafers up to 152mm in diameter, down to sizes as small as 1mm x 2mm, with minimal edge chipping.
- Slotting Capability: Allows precise slotting to specific depths on glass or similar materials.
- Rotary Table (Optional): Enables cutting at any angle, ideal for applications like cutting along crystal axes or “Brewster’s Angle.”
- Manual Height Adjustment: Rotary table offers manual z-axis height variation within 10μm for precise depth control.
Key Features – Annular
- Precise Slicing: The HPS Annular saw slices specimens accurately and thinly with minimal surface damage and kerf loss, capable of cutting wafer boules up to 78mm in diameter.
- Specialized for Fragile Materials: Ideal for slicing fragile and expensive materials like lithium niobate and gallium arsenide, with minimal kerf loss and damage.
- LED Market Application: Perfect for cutting materials such as gallium nitride used in the light-emitting diode (LED) market.
- Custom Optic Manufacturing: Enables the production of lenses, filters, and prisms/crystals for custom optical applications.
