The Logitech High Speed Lapping and Polishing machine provides a flexible, extremely reliable system for processing and analysis of hard materials, such as Gallium Nitride, Sapphire, Diamond and Silicon Carbide.
An array of advanced in-situ sensors constantly provide the operator with real-time process information. Monitored parameters include the CoF (during polishing), pad, slurry, plate and carrier/pad interface temperatures. These sensors will relay information back to the operator in order to identify and evaluate important process conditions or process stability – factors which are paramount for optimal performance.
The user interface on the high speed system utilises internationally accepted analytical software technology (Labview 10). All functions are controlled via the touch panel. Data can be taken from the in-situ process sensors and sub-systems and exported (via the USB port) to third party statistical or analytical software.
Adaptable and portable – Logitech quality as standard
- Advanced sensors provide consistent, real-time, process information
- High downloads from carrier head increases the polishing rate
- High plate speed, variable up to 300rpm
- Quick and easy plate and jig set-up