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Tribo High Speed Lapping and Polishing

Categories: Chemical Polishing & Chemical Mechanical Polishing, View All

Description

The Logitech Tribo High Speed Lapping and Polishing machine provides a flexible, extremely reliable system for processing and analysis of hard materials, such as Gallium Nitride, Sapphire, Diamond and Silicon Carbide.

An array of advanced in-situ sensors constantly provide the operator with real-time process information. Monitored parameters include the CoF (during polishing), pad, slurry, plate and carrier/pad interface temperatures. These sensors will relay information back to the operator in order to identify and evaluate important process conditions or process stability – factors which are paramount for optimal performance.

The Logitech High Speed Lapping and Polishing machines interface on the high speed system utilises internationally accepted analytical software technology (Labview 10). All functions are controlled via the touch panel. Data can be taken from the in-situ process sensors and sub-systems and exported (via the USB port) to third party statistical or analytical software.

Adaptable and portable – Logitech quality as standard

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Key Features

Advanced sensors provide consistent, real-time, process information
High downloads from carrier head increases the polishing rate
High plate speed, variable up to 300rpm
Quick and easy plate and jig set-up

Product Data:

Power Supply:	240V 16A single inlet
Fuse Rating:	16A
Plate Speed:	0-300rpm
Plate Diameter:	400mm
Plate Rotation:	Clockwise & counter clockwise
Carrier rotation speed	0-100rpm
Carrier Sizes Available:	up to 100mm (4″) wafer
Height:	1123mm
Depth:	911mm
Width:	1382mm
Net Weight:	292kg
Gross Packed Weight:	440kg
Chemical Compatability:	Acidic & Alkaline CMP Slurries
Cabinet details:	Self contained chemical resistant, bench top cabinet.

Semiconductors

Semiconductor materials are used in a wide variety of devices such as field effect transistors (MosFets, Fets), integrated circuits (ICs, MMICs, ASICs), focal plane arrays and infra-red detectors.

Whatever the application or material, each semiconductor wafer undergoes several common stages during manufacture, which include slicing the wafer from the crystal, preparing the surface prior to fabrication and thinning the device after fabrication through the use of lapping and polishing techniques.

Logitech provide complete system solutions including consumables for the precise thinning of these III-V, I.R. and similar materials.

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