The Logitech DP high speed polishing systems were developed to address the issue of polishing times when processing semiconductor materials often describe as “hard” to polish within the industry. These systems have been designed for semi-automated final stage polishing of hard materials such as sapphire, silicon carbide (SiC) or gallium nitride (GaN).
Available as a single or four workstations, the DP range can process materials up to 300mm (or multiple smaller samples) on the DP1 and 260mm per workstation (or multiple smaller samples) on the DP4. The DP systems feature special polishing carrier heads that apply high levels of down-force per carrier head onto the samples, whilst rotational speed and direction are fully controllable. This results in the highest level of sample throughput of any of the Logitech systems.
The capacity of the range of the DP systems make these ideal for small research laboratories through to production level environments.
The DP systems are chemically resistant to standard chemicals used in CMP applications, including sodium hypochlorite (Na OCL).
Typical Surface Finish Capabilities:
- Stand alone systems with single or four workstations, with a process capacity of up to 300mm on the DP1 and 260mm per workstation on the DP4 (or multiple smaller samples).
- The DP1 polishing carrier head can apply up to 200kg of download and the DP4 can apply up to 50kg of download per carrier head – resulting in the highest sample throughput of any Logitech polishing system.
- ‘Manual Mode’ allows operators to control individual process parameters and variables such as rotational speed and direction of carrier heads via the Graphical User Interface (GUI).
- ‘Automatic Mode’ allows users to save and re-call multi-stage process recipes – making each process completely repeatable, even across different operators.