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Home  /  View All  /  DP Precision Polishing Systems

DP Precision Polishing Systems

Categories: Driven Head Lapping & Polishing Tools, View All
  • DP Precision Polishing Systems
  • DP Precision Polishing Systems

Product Video:

  • Description
  • Facilities Requirement
  • Applications
  • Accessories & Consumables

Description

The Logitech DP Precision Polishing Systems were developed to address the issue of polishing times when processing semiconductor materials often describe as “hard” to polish within the industry. These systems have been designed for semi-automated final stage polishing of hard materials such as sapphire, silicon carbide (SiC) or gallium nitride (GaN).

Available as a single or four workstations, the DP Precision Polishing Systems can process materials up to 300mm (or multiple smaller samples) on the DP1 and 260mm per workstation (or multiple smaller samples) on the DP4. The DP systems feature special polishing carrier heads that apply high levels of down-force per carrier head onto the samples, whilst rotational speed and direction are fully controllable. This results in the highest level of sample throughput of any of the Logitech systems.

The capacity of the range of the DP Precision Polishing Systems make these ideal for small research laboratories through to production level environments.

The DP systems are chemically resistant to standard chemicals used in CMP applications, including sodium hypochlorite (Na OCL).

Typical Surface Finish Capabilities:
Sapphire: <1nm
GaN: <1nm
SiC: <3nm

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Key Features

  • Stand alone systems with single or four workstations, with a process capacity of up to 300mm on the DP1 and 260mm per workstation on the DP4 (or multiple smaller samples).
  • The DP1 polishing carrier head can apply up to 200kg of download and the DP4 can apply up to 50kg of download per carrier head – resulting in the highest sample throughput of any Logitech polishing system.
  • ‘Manual Mode’ allows operators to control individual process parameters and variables such as rotational speed and direction of carrier heads via the Graphical User Interface (GUI).
  • ‘Automatic Mode’ allows users to save and re-call multi-stage process recipes – making each process completely repeatable, even across different operators.
DP1 DP4
Capacity: 300mm carrier 4 of 260mm carriers
Power Supply: 230v 16A max 380-480Vac 3 phase
Fuse Rating: 12.5A 25A per phase
Plate Speed: 160rpm 100rpm
Plate Diameter: 560mm (22″) 700mm (27.6″)
Plate Rotation:  clockwise & counter clockwise
Carrier Speed: 10 – 125rpm 10 – 60rpm
Carrier Rotation:  clockwise & counter clockwise
Min Download:   carrier dependent
Max Download:  100kg 50kg
Height: 2030mm 2060mm
Depth:  1400mm 1440mm
Width: 900mm 2020mm
Min Slurry Flow Rate:  20ml/min 0-100ml/min
Max Slurry Flow Rate:  500ml/min 0-100ml/min
Net Weight: 470kg 703kg
Gross Packed Weight: 670kg 1127kg

Semiconductors

semiconductors

Semiconductor materials are used in a wide variety of devices such as field effect transistors (MosFets, Fets), integrated circuits (ICs, MMICs, ASICs), focal plane arrays and infra-red detectors.

Whatever the application or material, each semiconductor wafer undergoes several common stages during manufacture, which include slicing the wafer from the crystal, preparing the surface prior to fabrication and thinning the device after fabrication through the use of lapping and polishing techniques.

Logitech provide complete system solutions including consumables for the precise thinning of these III-V, I.R. and similar materials.

Optoelectronics

optoelectronics

Advances in communication technology have led to the development of a wide variety of optoelectronics and integrated optics devices for applications such as; dense wavelength division multiplexing (DWDM), optical isolators, signal processors and optical switching.

Logitech has a large selection of adaptable systems for the preparation of optoelectronic materials such as; silicon, lithium niobate, lithium tantalate, bismuith silicon oxide, barium titanate and similar materials.

Our systems, accessories and consumables provide defect free face and edge polishing on optoelectronic substrate and scratch free surfaces with exacting and repeatable dimensional tolerances.

Optics

optics

The importance of optical polishing and the processing of optical components has never been greater with the ongoing development of the telecommunications market. Whether for Infra Red and polymer waveguide production or fibre optic cable polishing.

The precision design and manufacture of our equipment enable you to obtain maximum results from the cutting, lapping and polishing of these optical materials.

CMP Applications

Primary applications areas are in the field of Tribology Science and Research, particularly with regards process and analysis results.  For example co-efficient of friction monitoring (CoF).

The Tribo chemical mechanical polishing system is also readily adaptable as an enabling technology in Microelectromechanical Systems (MEMS) fabrication, particularly polysilicon surface micromachining, Opto-MEMS and Bio-MEMS packaging, assembly and even fabrication.

Polishing Plates

polishingplates

The Logitech range of polishing plates provides a comprehensive selection for polishing a wide range of materials.

 

EP Polishing Pads and Cloths

Logitech EP1 and EP2 Chemical Mechanical Polishing (CMP) Polishing Cloths and pads are suitable for a wide range of applications.  Including oxide, nitride and copper.

 

IC1000 & Suba Polishing Pads and Cloths

Logitech IC1000 pads and Suba felts are specifically designed for stock and intermediate polishing where achieving a high precision surface is critical.  They can be used across a wide range of materials including; GaAs, silicon, glass, metals, quartz, ceramics, copper and diamond thin film.

 

Chemcloth Polishing Cloths

Logitech Chemcloth Polishing Cloths are designed to meet the needs of today’s (Chemical Mechanical Polishing (CMP) operations.

 

Diamond Polishing Powder

diamondpolishingpowder

Ideal for polishing small rock speciments, minerals, thin sections and metallic ores, where special lubricant carriers are requried.

 

Polishing Suspensions

Logitech polishing suspensions have been developed to suit a wide range of polishing applications in the semiconductor and optoelectronics industries.

 

Standard Templates

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