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CP3000 Chemical Polishing Systems

Categories: Chemical Polishing & Chemical Mechanical Polishing, View All

Description

The CP3000 uses a gear drive mechanism to rotate samples in planetary gears around a central drive, ensuring precise polishing and fine etching of thin and ultra-thin wafers. A joystick-controlled panel allows easy operation, and its components, like the chemical feed unit and removable PVC drip tray, streamline maintenance and durability.

The CP3000 is a versatile system designed for the precise processing of advanced materials. It is ideal for fine etching of semiconductor wafers made from Gallium Arsenide, Indium Phosphide, and other II-VI and III-V compounds, as well as for polishing delicate electro-optic crystals. The machine supports both aggressive polishing and less aggressive Chemlox polishing tasks. By integrating seamlessly with Logitech bonding and demounting equipment, it ensures valuable wafers are processed safely without front-side damage. Its compact design fits most fume cabinets, with an optional fume cabinet available, making it both space-efficient and highly effective.

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Key Features

Durable and Easy to Maintain: Corrosion-resistant chemical feed unit, drain tank, and removable PVC drip tray for protection and easy cleaning.
Precise Polishing: Gear drive mechanism rotates samples in planetary gears for fine etching and polishing of thin and ultra-thin wafers.
Material Versatility: Compatible with a range of semiconductor materials (e.g., Gallium Arsenide, Indium Phosphide) and electro-optic crystals.
Compact and Flexible: Fits most fume cabinets, with an optional Logitech fume cabinet and external control panel placement.
Safe Processing: Works seamlessly with Logitech bonding/demounting equipment to protect delicate wafers from front-side damage.

Technical Specification:

Wafer Capacity: Up to 3 X 75 mm (3”) or 3 X 100 mm (4”) wafers
Power supply: 220-240v, 50Hz or 110V, 50/60Hz
Fuse Rating: 10A
Polishing plate diameter: 356 mm (14”)
Plate Rotation Speed: 0 – 100 rpm (continuously variable)
Main Drive Unit (with feed system)
Height: 660 mm
Width: 450 mm
Depth: 415 mm
Control Unit
Height: 190 mm
Width: 550 mm
Depth: 320 mm

Combined Machine Weight (s): 42 kg

Semiconductors

Logitech delivers complete solutions, including consumables, for precise thinning of III-V, IR, and similar materials. Our systems support key stages like wafer slicing, surface preparation, and thinning for devices such as transistors, ICs, and IR detectors.

Optoelectronics

Logitech provides adaptable systems, accessories and consumables for preparing materials like silicon and lithium niobate, ensuring defect-free polishing and precise tolerances. These systems support advancements in devices like DWDM, optical switches, and signal processors.

Optics

Logitech’s precision equipment ensures optimal results in cutting, lapping, and polishing optical materials. Our solutions meet the growing demand for telecom applications like IR, waveguides, and fiber optics.

Weights and Pressure Blocks

Logitech supply weights and pressure blocks for use with Logitech lapping systems.

Polishing Suspensions

Logitech polishing suspensions have been developed to suit a wide range of polishing applications in the semiconductor and optoelectronics industries.

Chemcloth Polishing Cloths

Logitech Chemcloth Polishing Cloths are designed to meet the needs of today’s (Chemical Mechanical Polishing (CMP) operations.

Diamond Polishing Powder

Ideal for polishing small rock speciments, minerals, thin sections and metallic ores, where special lubricant carriers are requried.

Mounting Adhesives

Logitech provides a range of mounting media for bonding of semiconductor, optic and geological samples.

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