Product Data – Cast Iron Conditioners and Test Blocks:
| Size: |
Product Code: |
Finish: |
Description: |
| 127mm (5″) |
1ACCS-0300 |
Non-grooved |
Cast Iron lapping plate test block |
| 127mm (5″) |
1ACCS-0200 |
Grooved |
Cast Iron lapping plate test block |
| 150mm (6″) |
1ACCS-2000 |
Non-grooved |
Cast Iron lapping plate test block |
| 150mm (6″) |
1ACCS-2050 |
Grooved |
Cast Iron lapping plate test block |
| 189mm (7.44″) |
1ACCS-0325 |
Non-grooved |
Cast Iron lapping plate test block |
| 189mm (7.44″) |
1ACCS-0225 |
Grooved |
Cast Iron lapping plate test block |
| 210mm (8.4″) |
1ACCS-2025 |
Grooved |
Cast Iron lapping plate test block, stepped down to 189mm. |
| 127mm (5″) |
1ACCS-0600 |
Grooved |
Multi Grooved Conditioner |
Product Data – Glass Conditioners and Test Blocks:
| Size: |
Product Code: |
Finish: |
Description: |
| 127mm (5″) |
1ACCS-0400 |
Non-grooved |
Glass lapping plate test block |
| 127mm (5″) |
1ACCS-2200 |
Grooved |
Glass lapping plate test block |
| 150mm (6″) |
1ACCS-2100 |
Non-grooved |
Glass lapping plate test block |
| 150mm (6″) |
1ACCS-2350 |
Grooved |
Glass lapping plate test block |
| 189mm (7.44″) |
1ACCS-2325 |
Non-grooved |
Glass lapping plate test block |
Product Data – Diamond Conditioners:
The Diamond Conditioning Block is used to maintain the flatness of the Expanded Polyurethane plate. This is critical to ensure flatness across the plate, hence guaranteeing excellent flat uniform samples while polishing. Conditioning of the Expanded Polyurethane Pad is required using DI water and the Diamond Conditioning Block.
| Product Code: |
Description: |
| 1ACCS-0732 |
Diamond smoothing block with 200µm diamond pellets – use with expanded polyurethane, 178mm diameter. |
| 1ACCS-0732-SP |
Diamond smoothing block with 200µm diamond pellets – use with expanded polyurethane, 190mm diameter. Stepped down to 178mm. |
| 1ACCS-0755 |
Diamond conditioning disc for use with expanded polyurethane plates, 127mm (PM5, LP50) |
| 1ACCS-0770 |
Diamond smoothing block with 200µm diamond pellets for use with polytron and expanded polyurethane plates, 150mm diameter. |
| 1ACCS-0710 |
Diamond smoothing block with 200µm diamond pellets for use with polytron and expanded polyurethane plates, 300mm diameter. |
Geological Sciences
In many areas of geological study such as mineralogy, petrography and sedimentology you are required to analyse the characteristics of the materials such as soil or rock. To be able to do this a thin section needs to be prepared for microscopic examination.
Logitech precision equipment is ideal for thin or ultra-thin section preparation. Our wide range of versatile systems enable you to trim, lap and polish geological thin sections such as rock, coal, concete and soils.
Each of our systems are fully supported by a wide range of accessories and consumables, such as abrasive powders, polishing cloths and mounting media.
Semiconductors
Semiconductor materials are used in a wide variety of devices such as field effect transistors (MosFets, Fets), integrated circuits (ICs, MMICs, ASICs), focal plane arrays and infra-red detectors.
Whatever the application or material, each semiconductor wafer undergoes several common stages during manufacture, which include slicing the wafer from the crystal, preparing the surface prior to fabrication and thinning the device after fabrication through the use of lapping and polishing techniques.
Logitech provide complete system solutions including consumables for the precise thinning of these III-V, I.R. and similar materials.
CMP Applications
Primary applications areas are in the field of Tribology Science and Research, particularly with regards process and analysis results. For example co-efficient of friction monitoring (CoF).
The Tribo chemical mechanical polishing system is also readily adaptable as an enabling technology in Microelectromechanical Systems (MEMS) fabrication, particularly polysilicon surface micromachining, Opto-MEMS and Bio-MEMS packaging, assembly and even fabrication.
Optoelectronics
Advances in communication technology have led to the development of a wide variety of optoelectronics and integrated optics devices for applications such as; dense wavelength division multiplexing (DWDM), optical isolators, signal processors and optical switching.
Logitech has a large selection of adaptable systems for the preparation of optoelectronic materials such as; silicon, lithium niobate, lithium tantalate, bismuith silicon oxide, barium titanate and similar materials.
Our systems, accessories and consumables provide defect free face and edge polishing on optoelectronic substrate and scratch free surfaces with exacting and repeatable dimensional tolerances.
Optics
The importance of optical polishing and the processing of optical components has never been greater with the ongoing development of the telecommunications market. Whether for Infra Red and polymer waveguide production or fibre optic cable polishing.
The precision design and manufacture of our equipment enable you to obtain maximum results from the cutting, lapping and polishing of these optical materials.
Other Applications
Logitech systems are used by organisations across the world for many different complex sample preparation processes.
Including the thin section preparation of; Teeth, Bone, Otoliths, Ceramics, Metals, Alloys, Polymers and other Carbon-based materials.
Lapping Plates
The Logitech range of lapping plates provides a comprehensive selection for lapping of a wide range of materials.
Polishing Plates
The Logitech range of polishing plates provides a comprehensive selection for polishing a wide range of materials.
