New LP70 Lapping & Polishing System features in Silicon Semiconductor
2nd July 2019
Logitech has seen great success in the launch of the new multi-station, precision lapping & polishing system, the LP70. Respected industry trade publication, Silicon Semiconductor, has picked up on the launch and has created an editorial based around the benefits of Logitech automated systems used in wafer processes. Including increased productivity, process cost reductions and easy repeatable processes.
Read the article for insight on:
- How the LP70 can boost wafer productivity by 40%
- Achieving better process control via Preston’s Law and semi-automated features
- Detailed data from Silicon lapping and polishing trials on the LP70 including process parameters
- Utilizing time weighted average functionality to accurately control the process to achieve increased levels of accuracy that is easily repeatable
