After the successful launch of our multi-station, precision, lapping & polishing system, The LP70, we were pleased to ship out the very first customer unit this week from Logitech HQ in Glasgow, Scotland. This machine was first of many to be shipped out to a long-term customer in China who’s process requirements saw the need for higher throughput levels whilst still maintaining stringent sample specifications.
The addition of an extra workstation, in comparison to the LP70’s predecessor the LP50, allows for higher throughput levels whilst still maintaining the use of our automatic plate flatness software with Bluetooth enabled monitor. Intuitive features with improved functionality allows for increased material removal rates, with greater levels of control and reliable process repeatability.
The LP70 is the latest addition to our intelligent range of highly automated lapping and polishing systems and has been developed due to increasingly stringent industry standards.