Last week Logitech attended the Geo-technologists Symposium hosted in the University of Leeds. We previously attended this symposium in 2017 which was hosted at the University of Durham, and again this year was as great a success as the previous years.
The symposium brings together experts in the fields of geological thin section preparation and gives them opportunity to share their own personal techniques and approaches in their research. Logitech were honored to have been invited back for a second time to present our worldwide standard in geological thin section preparation. We chose to bring our newest system, the LP70, to allow attendee’s (most of whom are existing Logitech customers) the opportunity to see the system one on one. Our in-house geological thin section preparation expert, John McCrossan (or “Geo-John” as we like to call him), provided a demonstration in the set up and process of thin section preparation on the LP70. This allowed attendee’s to view three key stages of thin section preparation; first face lapping, second face lapping and final stage polishing.
Geological Thin Section Preparation is generally split in to eight key stages of processing:
- Step 1: Slabbing & Trimming of Field Specification
- Step 2: Impregnation of soft, porous of friable materials
- Step 3: First face lapping of cut materials
- Step 4: Preparation of slides to uniform thickness
- Step 5: Bonding specimens to prepared slides
- Step 6: Thinning bonded specimen
- Step 7: Lapping specimen to required thickness
- Step 8: Polishing specimen
Thank you to everyone who was involved with making the day such a success and special thanks to Ian Chaplin and Sophie Edwards from the University of Durham for organising the event.