Application Process Notes

Logitech know how.

We have developed a wide range of  application notes in order for you to gain a deeper understanding of the technologies involved in working with certain materials and applications.

Each application note details process requirements, methodologies and system specifications required in order to process a sample to its optimum geometric control.

gaas wafer backthinning

4” GaAs Wafer Backthinning

polishing-fibre-arrays

Polishing Fibre Arrays

concrete thin section

Concrete Thin Section Production

thin section prep

Thin Section Preparation

coal thin and ultra thin

Coal Thin & Ultra Thin Section Preparation

fused wafers

Fused Wafers

laser rod polishing

Laser Rod Polishing

LED substrate prep

LED Substrate Preparation
Silicon Carbide, Sapphire & Gallium Nitride

silicon-carbide-sapphre-gallium-nitride-sub-prep

Silicon Carbide, Sapphire & Gallium Nitride
Substrate Preparation

silicon-on-silicon

Silicon on Silicon

tooth thin sec prep

Tooth Thin Section Preparation