Application Process Notes

Logitech know how.

We have developed a wide range of  application notes in order for you to gain a deeper understanding of the technologies involved in working with certain materials and applications.

Each application note details process requirements, methodologies and system specifications required in order to process a sample to its optimum geometric control.

4” GaAs Wafer Backthinning

Polishing Fibre Arrays

Concrete Thin Section Production

Thin Section Preparation

Coal Thin & Ultra Thin Section Preparation

Fused Wafers

Laser Rod Polishing

LED Substrate Preparation
Silicon Carbide, Sapphire & Gallium Nitride

Silicon Carbide, Sapphire & Gallium Nitride
Substrate Preparation

Silicon on Silicon

Tooth Thin Section Preparation