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      • Optics
      • Other applications
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      • Silicon Carbide
      • Sapphire
      • Gallium Arsenide
      • Cadmium Zinc Telluride
      • Indium Phosphide
      • Rock/Soil
      • Other Materials
  • Products & Solutions
    • Lapping & Polishing
    • Chemical Polishing & Chemical Mechanical Polishing
    • Driven Head Lapping & Polishing Tools
    • Bonding & Impregnation Units
    • Test & Measurement
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Home  /  View our Lapping & Polishing Systems  /  WG2 Polishing System

WG2 Polishing System

Categories: View All, View our Lapping & Polishing Systems
  • WG2 Polishing System
  • Description
  • Facilities Requirement
  • Applications
  • Accessories & Consumables

Description

WG2 Polishing Head

Logitech’s WG2 Polishing System, compatible with the now discontinued Logitech PM5 precision polishing machine, is capable of producing the desired finished sample to a very high standard. This can be high reflectivity, low relief, ultra-flat surfaces or minimal edge roll-off.

System Features:
The system is highly versatile, offering a wide range of facilities including variable plate and carousel speed and rotational direction.  Samples can be polished individually or in batches, using a variety of sample holders.  Ideal for rock polishing.

The robust WG2 Polishing System is manufactured using corrosion resistant materials, enabling use with more aggressive process routes. The powerful, low voltage DC motor provides sufficient torque to rotate the fully loaded carousel at a speed up to 25 rpm.

Samples are retained by six drive rods, enabling each specimen to rotate independently.

Incremental loads up to 1.35 kg may be placed on each drive rod to assist with the polishing process. A double load bar provides the facility to increase loading at three positions for large area specimens, i.e. 76 x 51mm.

Please note the WG2 Polishing System is only available for customers with existing compatible PM5 systems. If you do not have a Logitech lapping & polishing system and are interested in polishing geological thin or ultra thin sections please see the PM6 Precision Lapping & Polishing system and the WG6 Polishing System for more information.

Visit our Online Consumables store

Download Brochure

Key Features

  • Compatible with Logitech PM5 precision polishing system
  • Superior quality surface finish
  • High capacity output
  • Automatic plate flatness control
  • Low operating costs

 

 WG2 Polishing Head
 Height: 270mm
 Net Weight: 21kg
 Max Sample Load: 1.35kg
 Carousel Speed: 0-35 rpm

Geological Sciences

geologicalsciences

In many areas of geological study such as mineralogy, petrography and sedimentology you are required to analyse the characteristics of the materials such as soil or rock.  To be able to do this a thin section needs to be prepared for microscopic examination.

Logitech precision equipment is ideal for thin or ultra-thin section preparation.  Our wide range of versatile systems enable you to trim, lap and polish geological thin sections such as rock, coal, concete and soils.

Each of our systems are fully supported by a wide range of accessories and consumables, such as abrasive powders, polishing cloths and mounting media.

Glass Microscope Slides

Logitech glass microscope slides are used for the permanent mounting of thin rock, concrete and soil thin sections.

Glass Slide Coverslips

Glass coverslips protect valuable thin sections and improve optical clarity for transmitted microscopy

Silicon Carbide Powders

For use in high precision lapping and polishing operations.  Available in a wide range of grit sizes.

Diamond Polishing Powder

diamondpolishingpowder

Ideal for polishing small rock speciments, minerals, thin sections and metallic ores, where special lubricant carriers are requried.

Cleaning Fluids & Powders

Logitech cleaning fluids and powders and non-solvent based.  They are suitable for most sample and substrate cleaning applications, including demounting of ultra-thin semiconductor wafers.

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Expert news and views to help sharpen your cutting edge

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THE END OF THE CHIP FOR SILICON?

Silicon-based semiconducting integrated circuits have changed the world immeasurably over the past 50 years. Today the number of silicon chips in use far outweighs the number of humans currently alive.

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The wafers used to make semiconducting chips for electronic devices all have one thing in common – they need to be smooth – super smooth. Typically, wafer flatness needs to be controlled within ±2 μm.

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