Extranet Login

t: +44 (0)1389 875444|e:enquiries@logitech.uk.com

  • Who we are
    • Our History
    • Meet the team
    • Quality
    • Our Environmental Policies
      • Our WEEE Policy
    • Careers
  • What we offer
    • By application
      • Semiconductors
      • Geological Sciences
      • Optoelectronics
      • Optics
      • Other applications
    • By material
      • Silicon
      • Silicon Carbide
      • Sapphire
      • Gallium Arsenide
      • Cadmium Zinc Telluride
      • Indium Phosphide
      • Rock/Soil
      • Other Materials
  • Products & Solutions
    • Lapping & Polishing
    • Chemical Polishing & Chemical Mechanical Polishing
    • Driven Head Lapping & Polishing Tools
    • Bonding & Impregnation Units
    • Test & Measurement
    • Cutting & Sawing
    • Accessories
    • Consumables – Online Store
  • Knowledge base
    • Safety Data Sheets
    • Whitepapers
    • Tech Files – Blog
    • Technology Transfer Programme
    • Brochures
    • Application Process Notes
    • Case Studies
    • FAQ
  • News & Events
    • News
    • Events
  • Contact
    • How to find us
    • Global Distributors
    • Equipment Returns
Menu
  • Who we are
    • Our History
    • Meet the team
    • Quality
    • Our Environmental Policies
      • Our WEEE Policy
    • Careers
  • What we offer
    • By application
      • Semiconductors
      • Geological Sciences
      • Optoelectronics
      • Optics
      • Other applications
    • By material
      • Silicon
      • Silicon Carbide
      • Sapphire
      • Gallium Arsenide
      • Cadmium Zinc Telluride
      • Indium Phosphide
      • Rock/Soil
      • Other Materials
  • Products & Solutions
    • Lapping & Polishing
    • Chemical Polishing & Chemical Mechanical Polishing
    • Driven Head Lapping & Polishing Tools
    • Bonding & Impregnation Units
    • Test & Measurement
    • Cutting & Sawing
    • Accessories
    • Consumables – Online Store
  • Knowledge base
    • Safety Data Sheets
    • Whitepapers
    • Tech Files – Blog
    • Technology Transfer Programme
    • Brochures
    • Application Process Notes
    • Case Studies
    • FAQ
  • News & Events
    • News
    • Events
  • Contact
    • How to find us
    • Global Distributors
    • Equipment Returns
Home  /  Chemical Polishing & Chemical Mechanical Polishing  /  CMP-Tribo Benchtop CMP System

CMP-Tribo Benchtop CMP System

Categories: Chemical Polishing & Chemical Mechanical Polishing, View All
  • Tribo CMP System
  • Tribo CMP System

Product Video:

  • Description
  • Facilities Requirement
  • Applications
  • Accessories & Consumables

Description

Logitech’s Tribo CMP System offers nanometer level material removal capabilities on either individual die or wafers up to 100mm/4″ diameter.  This CMP solution is suitable for a wide variety of wafer/substrate materials used in todays device fabrication processes.

The Tribo CMP System achieves industry standards in control and layer removal for CMP and produces laser quality surfaces (0/0 scratch dig), making improvements to surface topography.  You can also achieve Ra to subnanometer levels on substrates with this system.

 

This highly versatile system can be tailored through the use of different carrier heads, polishing templates, wet bench modules or end point detection.

The Tribo allows you to collect numerous data variables via multiple sensors, in order to identify and analyse various in-situ factors on the material samples being processed.  The integrated, real-time analytical software allows you to convert this data into useable information.  The software can be easily exported into standard packages such as Microsoft Excel.

Specific applications where the Tribo can be used include:

  • Silicon Wafer CMP
  • Global CMP of III-V Compound Semiconductors
  • Global CMP of Silicon Nitride, Oxides & Polymer Layers
  • Global CMP of brittle, friable IR material substrates
  • Global CMP of Sapphire, Gallium Nitride & Silicon Carbide substrates
  • Reclamation of EPI ready substrates
  • Final stage thinning of SOS and SOI wafers to below 20 microns
  • Device delayering for reverse engineering of FA applications

Further features and benefits of this system include:

  • In process diamond conditioning
  • Process both hard and soft materials
  • Wide range of wafer sizes catered for
  • High downward load settings available
  • Back pressure settings for better process results
  • End point detection available to monitor polishing in real time

Visit our Online Consumables store

Download Brochure

Key Features

  • Ideal for Tribological and Chemical Mechanical Polishing Applications
  • Precision processing of wafers up to 100mm (4″)
  • In-situ pad conditioner optimises pad condition
  • Benchtop solution

Product Data:

Power Supply: Single Phase, Neutral, Earth. 220v-240v
Fuse Rating: 16A RCBO
Plate Speed: 0-100rpm
Plate Diameter: 400mm
Plate Rotation: Forward & Reverse direction settings
Carrier 1 Speed 10-100rpm
Carrier 2 Speed 10-100rpm Max.
Carrier Sizes Available: 100mm (4″) wafer
Height: 1123mm
Depth: 885mm-985mm (including screen)
Width: 1234mm-1382mm (including pipes)
Net Weight: 260Kg
Gross Packed Weight: 440Kg
Chemical Compatability:  Acidic & Alkaline CMP Slurries

CMP Applications

Primary applications areas are in the field of Tribology Science and Research, particularly with regards process and analysis results.  For example co-efficient of friction monitoring (CoF).

The Tribo chemical mechanical polishing system is also readily adaptable as an enabling technology in Microelectromechanical Systems (MEMS) fabrication, particularly polysilicon surface micromachining, Opto-MEMS and Bio-MEMS packaging, assembly and even fabrication.

Semiconductors

semiconductors

Semiconductor materials are used in a wide variety of devices such as field effect transistors (MosFets, Fets), integrated circuits (ICs, MMICs, ASICs), focal plane arrays and infra-red detectors.

Whatever the application or material, each semiconductor wafer undergoes several common stages during manufacture, which include slicing the wafer from the crystal, preparing the surface prior to fabrication and thinning the device after fabrication through the use of lapping and polishing techniques.

Logitech provide complete system solutions including consumables for the precise thinning of these III-V, I.R. and similar materials.

Polishing Plates

polishingplates

The Logitech range of polishing plates provides a comprehensive selection for polishing a wide range of materials.

Chemcloth Polishing Cloths

Logitech Chemcloth Polishing Cloths are designed to meet the needs of today’s (Chemical Mechanical Polishing (CMP) operations.

EP Polishing Pads and Cloths

Logitech EP1 and EP2 Chemical Mechanical Polishing (CMP) Polishing Cloths and pads are suitable for a wide range of applications. Including oxide, nitride and copper.

Polishing Suspensions

Logitech polishing suspensions have been developed to suit a wide range of polishing applications in the semiconductor and optoelectronics industries.

Standard Templates

the-tech-files

Expert news and views to help sharpen your cutting edge

DIAMONDS ARE AN ENGINEER’S BEST FRIEND

In recent years, diamond has emerged as not only a girl’s best friend, but also as contender as an engineer’s best friend – if the technical challenges of exploiting its remarkable properties can be overcome.

LOGIN TO VIEW

THE END OF THE CHIP FOR SILICON?

Silicon-based semiconducting integrated circuits have changed the world immeasurably over the past 50 years. Today the number of silicon chips in use far outweighs the number of humans currently alive.

LOGIN TO VIEW

OPTIMAL FRICTION FOR OPTIMAL FLATNESS

The wafers used to make semiconducting chips for electronic devices all have one thing in common – they need to be smooth – super smooth. Typically, wafer flatness needs to be controlled within ±2 μm.

FREE TO VIEW
contact-us-icon
contact-us-icon
contact-us-icon

Home  |  Sitemap  |  Privacy Policy  |  Contact Us  |  Extranet |

We are using cookies to give you the best experience on our website.

You can find out more about which cookies we are using or switch them off in settings.

Powered by  GDPR Cookie Compliance
Privacy Overview

This website uses cookies so that we can provide you with the best user experience possible. Cookie information is stored in your browser and performs functions such as recognising you when you return to our website and helping our team to understand which sections of the website you find most interesting and useful.

Strictly Necessary Cookies

Strictly Necessary Cookie should be enabled at all times so that we can save your preferences for cookie settings.

If you disable this cookie, we will not be able to save your preferences. This means that every time you visit this website you will need to enable or disable cookies again.