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CMP-Tribo Benchtop CMP System

Categories: Chemical Polishing & Chemical Mechanical Polishing, View All

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Description

Logitech’s Tribo CMP System offers nanometer level material removal capabilities on either individual die or wafers up to 100mm/4″ diameter. This CMP solution is suitable for a wide variety of wafer/substrate materials used in todays device fabrication processes.

The Tribo CMP System achieves industry standards in control and layer removal for CMP and produces laser quality surfaces (0/0 scratch dig), making improvements to surface topography. You can also achieve Ra to subnanometer levels on substrates with this system.

This highly versatile system can be tailored through the use of different carrier heads, polishing templates, wet bench modules or end point detection.

The Tribo allows you to collect numerous data variables via multiple sensors, in order to identify and analyse various in-situ factors on the material samples being processed. The integrated, real-time analytical software allows you to convert this data into useable information. The software can be easily exported into standard packages such as Microsoft Excel.

Specific applications where the Tribo can be used include:

Silicon Wafer CMP
Global CMP of III-V Compound Semiconductors
Global CMP of Silicon Nitride, Oxides & Polymer Layers
Global CMP of brittle, friable IR material substrates
Global CMP of Sapphire, Gallium Nitride & Silicon Carbide substrates
Reclamation of EPI ready substrates
Final stage thinning of SOS and SOI wafers to below 20 microns
Device delayering for reverse engineering of FA applications

Further features and benefits of this system include:

In process diamond conditioning
Process both hard and soft materials
Wide range of wafer sizes catered for
High downward load settings available
Back pressure settings for better process results
End point detection available to monitor polishing in real time

Post CMP Cleaning
Please contact Logitech for post CMP cleaning options.

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Key Features

Ideal for Tribological and Chemical Mechanical Polishing Applications
Precision processing of wafers up to 100mm (4″)
In-situ pad conditioner optimises pad condition
Benchtop solution

Product Data:

Power Supply:	Single Phase, Neutral, Earth. 220v-240v
Fuse Rating:	16A RCBO
Plate Speed:	0-100rpm
Plate Diameter:	400mm
Plate Rotation:	Forward & Reverse direction settings
Carrier 1 Speed	10-100rpm
Carrier 2 Speed	10-100rpm Max.
Carrier Sizes Available:	100mm (4″) wafer
Height:	1123mm
Depth:	885mm-985mm (including screen)
Width:	1234mm-1382mm (including pipes)
Net Weight:	260Kg
Gross Packed Weight:	440Kg
Chemical Compatability:	Acidic & Alkaline CMP Slurries

CMP Applications

Primary applications areas are in the field of Tribology Science and Research, particularly with regards process and analysis results. For example co-efficient of friction monitoring (CoF).

The Tribo chemical mechanical polishing system is also readily adaptable as an enabling technology in Microelectromechanical Systems (MEMS) fabrication, particularly polysilicon surface micromachining, Opto-MEMS and Bio-MEMS packaging, assembly and even fabrication.

Semiconductors

Semiconductor materials are used in a wide variety of devices such as field effect transistors (MosFets, Fets), integrated circuits (ICs, MMICs, ASICs), focal plane arrays and infra-red detectors.

Whatever the application or material, each semiconductor wafer undergoes several common stages during manufacture, which include slicing the wafer from the crystal, preparing the surface prior to fabrication and thinning the device after fabrication through the use of lapping and polishing techniques.

Logitech provide complete system solutions including consumables for the precise thinning of these III-V, I.R. and similar materials.

Polishing Plates

The Logitech range of polishing plates provides a comprehensive selection for polishing a wide range of materials.

Chemcloth Polishing Cloths

Logitech Chemcloth Polishing Cloths are designed to meet the needs of today’s (Chemical Mechanical Polishing (CMP) operations.

EP Polishing Pads and Cloths

Logitech EP1 and EP2 Chemical Mechanical Polishing (CMP) Polishing Cloths and pads are suitable for a wide range of applications. Including oxide, nitride and copper.

Polishing Suspensions

Logitech polishing suspensions have been developed to suit a wide range of polishing applications in the semiconductor and optoelectronics industries.

Standard Templates

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