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SWC3000 – Post CMP Cleaner

Categories: Chemical Polishing & Chemical Mechanical Polishing, View All

Description

Logitech’s SWC3000 offers Single Wafer Cleaning bench top System for damage-free, optimised cleaning for wafers and masks used in the MEMS and Semiconductor Industry.

The SWC3000 system provide controlled chemical dispensing capabilities, allowing for enhanced particle removal from the specimen surface. Utilising the chemical dispensing functionality alongside the megasonic cleaning technology allows for highly optomised cleaning.

The released particles are removed from the substrate surface by sweeping off the particles with the radial flow of the de-ionised water. Without this feature, stationary cleaning tanks allow for a greater number of particle reattachments therefore requiring further cleaning time to remove.

The SWC3000 system is capable of in-situ spin drying with heated N2 or IPA. “Dry-In-Dry-Out” one step processing is possible with the lowest capital investment and cost of ownership. The process time for SWC systems can vary between 3-5 minutes per substrate, depending on the size and cleaning options used.

The SWC3000 systems has a small footprint, making them the ideal solution for any clean room with limited space looking for superior cleaning abilities across a variety of substrates.

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Key Features

Designed for the cleaning of single wafers up to 300mm/12″
Ideal for the cleaning of patterned and un-patterned, Germanium (Ge), Galluim Arsendie (GaAs) and Indium Phosphide (InP) wafers
Perfect solution for post CMP cleaning, cleaning of diced chips on a wafer frame, cleaning after plasma etch or photoresist stripping, mask blanks or contact mask cleaning and optic lense cleaning
Systems come with a chemical dispense unit as standard, allowing for control over the amount of chemicals used in the cleaning process – reducing wastage and improving total cost of ownership.
Chemical dispense unit allows particles to be easily removed from the substrate surface with the minimal amount of reattachments as possible – in comparison to stationary cleaning tanks.
Suck-back valves prevents drips and the systems come with separate solvent and acid drains

Options

Mask or wafer
Brush cleaning
Top and bottom rinse and dry
Nitrogen and CO2 lonizers
Fire Resistant Cabinet

Product Specification:

Systems	SWC-3000 SWC-4000
Height: System RF Power Supply Chemical box	419mm 153mm 1372mm 356mm
Width: System RF Power Supply Chemical box	482mm 287mm 711mm 229mm
Depth: System RF Power Supply Chemical box	660mm 431mm 813mm 585mm
Power Supply:	110v 15A / 230v 15A 50/60Hz 110v 15A / 230v 15A 50/60Hz

Semiconductors

Semiconductor materials are used in a wide variety of devices such as field effect transistors (MosFets, Fets), integrated circuits (ICs, MMICs, ASICs), focal plane arrays and infra-red detectors.

Whatever the application or material, each semiconductor wafer undergoes several common stages during manufacture, which include slicing the wafer from the crystal, preparing the surface prior to fabrication and thinning the device after fabrication through the use of lapping and polishing techniques.

Logitech provide complete system solutions including consumables for the precise thinning of these III-V, I.R. and similar materials.

Optics

The importance of optical polishing and the processing of optical components has never been greater with the ongoing development of the telecommunications market. Whether for Infra Red and polymer waveguide production or fibre optic cable polishing.

The precision design and manufacture of our equipment enable you to obtain maximum results from the cutting, lapping and polishing of these optical materials.

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