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      • Indium Phosphide
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  • Products & Solutions
    • Lapping & Polishing
    • Chemical Polishing & Chemical Mechanical Polishing
    • Driven Head Lapping & Polishing Tools
    • Bonding & Impregnation Units
    • Test & Measurement
    • Cutting & Sawing
    • Accessories
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Home  /  Cutting & Sawing  /  Model 15 Diamond & Wire Disc Saw

Model 15 Diamond & Wire Disc Saw

Categories: Cutting & Sawing, View All
  • Model 15 Saw
  • Model 15 Diamond & Wire Saw
  • Model 15 Saw
  • Model 15 Diamond & Wire Saw
  • Description
  • Facilities Requirement
  • Applications
  • Accessories & Consumables

Description

Logitech’s Model 15 Diamond & Wire Disc Saw is a compact saw, ideal for the precision slicing and dicing of materials from the most delicate crystals to the hardest ceramics.

Diamond wire:

The diamond wire cutting head is used whenever there is a requirement to produce a cut with minimum surface and sub-surface damage.  This is the most gentle method of cutting available and is perfect for low speed cutting of brittle and delicate specimens. Kerf loss is dependent on the wire diameter but is typically 0.25mm (0.009″)

Diamond disc:

Diamond discs are suitable for the cutting of less delicate or harder materials, where sub-surface damage is less important.  The cutting action of diamond discs is very effective on hard ceramics, electro-optic materials and robust semiconductor materials.  Kerf loss is typically 0.5mm (0.02″) but with a higher geometric accuracy than cuts with a diamond wire.

Abrasive disc:

Abrasive discs are for the cutting of metals.  The model 15 saw is most effective with a silicon carbide disc, which allows metals with a hardness up to Moh 8 to be cut.

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Key Features

  • Low surface damage wire cutting
  • Quick and simple diamond disc cutting
  • Fast wire to disc interchange
  • Adjustable cut-out for automatic operation
  • Caters for a variety of specimen holding configurations

Technical Specifications:

Motor: 0-180V D.C
Controller: Thryistor full wave feedback
Coolant pump: 12V vane pump
Cross-slide: 105mm (4.13″) cross travel/1 rev of dial – 1mm (0.04″) movement
Depth of cut: Wire – 50mm (1.97″)
Depth of cut: Disc – 50mm (1.97″) with 150mm (6″) disc
Speed: Full load – 2000rpm
Weight: 38kg
Height: 640mm
Width: 620mm
Depth: 510mm

Semiconductors

semiconductors

Semiconductor materials are used in a wide variety of devices such as field effect transistors (MosFets, Fets), integrated circuits (ICs, MMICs, ASICs), focal plane arrays and infra-red detectors.

Whatever the application or material, each semiconductor wafer undergoes several common stages during manufacture, which include slicing the wafer from the crystal, preparing the surface prior to fabrication and thinning the device after fabrication through the use of lapping and polishing techniques.

Logitech provide complete system solutions including consumables for the precise thinning of these III-V, I.R. and similar materials.

Optoelectronics

optoelectronics

Advances in communication technology have led to the development of a wide variety of optoelectronics and integrated optics devices for applications such as; dense wavelength division multiplexing (DWDM), optical isolators, signal processors and optical switching.

Logitech has a large selection of adaptable systems for the preparation of optoelectronic materials such as; silicon, lithium niobate, lithium tantalate, bismuith silicon oxide, barium titanate and similar materials.

Our systems, accessories and consumables provide defect free face and edge polishing on optoelectronic substrate and scratch free surfaces with exacting and repeatable dimensional tolerances.

Optics

optics

The importance of optical polishing and the processing of optical components has never been greater with the ongoing development of the telecommunications market. Whether for Infra Red and polymer waveguide production or fibre optic cable polishing.

The precision design and manufacture of our equipment enable you to obtain maximum results from the cutting, lapping and polishing of these optical materials.

Geological Sciences

geologicalsciences

In many areas of geological study such as mineralogy, petrography and sedimentology you are required to analyse the characteristics of the materials such as soil or rock.  To be able to do this a thin section needs to be prepared for microscopic examination.

Logitech precision equipment is ideal for thin or ultra-thin section preparation.  Our wide range of versatile systems enable you to trim, lap and polish geological thin sections such as rock, coal, concete and soils.

Each of our systems are fully supported by a wide range of accessories and consumables, such as abrasive powders, polishing cloths and mounting media.

Saw Blades & Cutting Wires

High quality diamond and silicon carbide saw blades and a selection of steel and diamond cutting wire to fit all Logitech saws.

Carrier Disc & Substrates

Logitech glass carrier discs are used for the temporary support of both semiconductor and opto-electronics wafers during thinning and polishing operations.

the-tech-files

Expert news and views to help sharpen your cutting edge

DIAMONDS ARE AN ENGINEER’S BEST FRIEND

In recent years, diamond has emerged as not only a girl’s best friend, but also as contender as an engineer’s best friend – if the technical challenges of exploiting its remarkable properties can be overcome.

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THE END OF THE CHIP FOR SILICON?

Silicon-based semiconducting integrated circuits have changed the world immeasurably over the past 50 years. Today the number of silicon chips in use far outweighs the number of humans currently alive.

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OPTIMAL FRICTION FOR OPTIMAL FLATNESS

The wafers used to make semiconducting chips for electronic devices all have one thing in common – they need to be smooth – super smooth. Typically, wafer flatness needs to be controlled within ±2 μm.

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