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      • Our WEEE Policy
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      • Other applications
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      • Silicon Carbide
      • Sapphire
      • Gallium Arsenide
      • Cadmium Zinc Telluride
      • Indium Phosphide
      • Rock/Soil
      • Other Materials
  • Products & Solutions
    • Lapping & Polishing
    • Chemical Polishing & Chemical Mechanical Polishing
    • Driven Head Lapping & Polishing Tools
    • Bonding & Impregnation Units
    • Test & Measurement
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Home  /  View All  /  DL Precision Lapping Systems

DL Precision Lapping Systems

Categories: Driven Head Lapping & Polishing Tools, View All
  • DL Precision Lapping Systems
  • DL Precision Lapping Systems

Product Video:

  • Description
  • Facilities Requirement
  • Applications
  • Accessories & Consumables

Description

Logitech’s DL high-speed lapping systems process materials with high geometric precision. The capacity range of the DL systems make them ideal for small research laboratories through to production environments. The DL also has the ability to process multiple small samples with the use of custom Logitech templates and chuckfaces. Available with a single workstation (DL1) or four workstations (DL4) these versatile lapping machines are capable of lapping samples up to 200mm/8”.

The DL Precision Lapping Systems are chemically resistant to standard chemicals used in CMP applications , including sodium hypochlorite (Na OCL).

DL44

The Logitech DL44 is ideal for high volume geological thin section and ultra-thin section preparation. With four workstations the DL44 has the capacity to process up to 56 standard thin sections at the one time. Alongside it’s driven head technology, which allows for quicker processes, this system is ideal for production environments.

With the option of an additional plate and Logitech VCB7 Jigs the DL44 can also be utilised for thin section final stage polishing.

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Key Features

  • Process capacity of up to 200mm/8″ per station or up to 56 standard thin sections on the DL44.
  • Motor driven lapping jigs allowing for high geometric accuracy and consistent sample rotation throughout the process – resulting in excellent wafer uniformity.
  • Metered abrasive feed system via peristaltic pumps allows operators to set the flow rate between 5-100ml/min – increasing quality and accuracy while reducing wastage and operational costs.
  • Process parameters controlled via the systems graphical user interface (GUI) including abrasive feed system flow rate and MRR.
  • Recipe mode allows operators to save and re-call multi-stage processes – making each process completely repeatable.
DL1 DL4
Jig Capacity – PP9 (up to 8″) samples: 1 4
Power Supply: 220-240v 13A max 400-500Vac 3 phase
Fuse Rating: 12.5A 25A per phase
Plate Speed: 160rpm 0 – 100rpm
Plate Diameter: 560mm (22″) 700mm (27.6″)
Plate Rotation: counter clockwise
Carrier Speed: 10 – 125rpm 10 – 60rpm
Carrier Rotation: clockwise & counter clockwise
Min Download: carrier dependent
Max Download: 100kg 50kg
Height: 2030mm 2030mm
Depth: 1400mm 1440mm
Width: 800mm 1140mm
Min Slurry Flow Rate: 20ml/min 20ml/min
Max Slurry Flow Rate: 500ml/min 500ml/min
Net Weight – without plates: 490kg 580kg
Gross Packed Weight: 600kg 980kg
Typical Plate Weight: 31kg 78kg

Semiconductors

semiconductors

Semiconductor materials are used in a wide variety of devices such as field effect transistors (MosFets, Fets), integrated circuits (ICs, MMICs, ASICs), focal plane arrays and infra-red detectors.

Whatever the application or material, each semiconductor wafer undergoes several common stages during manufacture, which include slicing the wafer from the crystal, preparing the surface prior to fabrication and thinning the device after fabrication through the use of lapping and polishing techniques.

Logitech provide complete system solutions including consumables for the precise thinning of these III-V, I.R. and similar materials.

Optoelectronics

optoelectronics

Advances in communication technology have led to the development of a wide variety of optoelectronics and integrated optics devices for applications such as; dense wavelength division multiplexing (DWDM), optical isolators, signal processors and optical switching.

Logitech has a large selection of adaptable systems for the preparation of optoelectronic materials such as; silicon, lithium niobate, lithium tantalate, bismuith silicon oxide, barium titanate and similar materials.

Our systems, accessories and consumables provide defect free face and edge polishing on optoelectronic substrate and scratch free surfaces with exacting and repeatable dimensional tolerances.

Optics

optics

The importance of optical polishing and the processing of optical components has never been greater with the ongoing development of the telecommunications market. Whether for Infra Red and polymer waveguide production or fibre optic cable polishing.

The precision design and manufacture of our equipment enable you to obtain maximum results from the cutting, lapping and polishing of these optical materials.

CMP Applications

Primary applications areas are in the field of Tribology Science and Research, particularly with regards process and analysis results.  For example co-efficient of friction monitoring (CoF).

The Tribo chemical mechanical polishing system is also readily adaptable as an enabling technology in Microelectromechanical Systems (MEMS) fabrication, particularly polysilicon surface micromachining, Opto-MEMS and Bio-MEMS packaging, assembly and even fabrication.

Weights and Pressure Blocks

weightsandpressureblocks

Logitech supply weights and pressure blocks for use with Logitech lapping systems.

 

Lapping Plates

lappingplates

The Logitech range of lapping plates provides a comprehensive selection for lapping of a wide range of materials.

 

Conditioners/Test Blocks

conditionerstestblocks

We supply a range of cast iron and glass test blocks as well as cast iron, glass and diamond conditioners for your lapping applications.

 

Silicon Carbide Powders

For use in high precision lapping and polishing operations.  Available in a wide range of grit sizes.

 

Boron Carbide Lapping Powder

Boron Carbide is used for the processing of ceramics, sapphire, heat treated alloys and very hard minerals.

 

Cleaning Fluids & Powders

Logitech cleaning fluids and powders and non-solvent based.  They are suitable for most sample and substrate cleaning applications, including demounting of ultra-thin semiconductor wafers.

 

Carrier Disc & Substrates

Logitech glass carrier discs are used for the temporary support of both semiconductor and opto-electronics wafers during thinning and polishing operations.

the-tech-files

Expert news and views to help sharpen your cutting edge

DIAMONDS ARE AN ENGINEER’S BEST FRIEND

In recent years, diamond has emerged as not only a girl’s best friend, but also as contender as an engineer’s best friend – if the technical challenges of exploiting its remarkable properties can be overcome.

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THE END OF THE CHIP FOR SILICON?

Silicon-based semiconducting integrated circuits have changed the world immeasurably over the past 50 years. Today the number of silicon chips in use far outweighs the number of humans currently alive.

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OPTIMAL FRICTION FOR OPTIMAL FLATNESS

The wafers used to make semiconducting chips for electronic devices all have one thing in common – they need to be smooth – super smooth. Typically, wafer flatness needs to be controlled within ±2 μm.

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