Product Description
Logitech DL high speed lapping systems process materials with high geometric precision. The four station DL4 is capable of processing up to 4 200mm (8″) samples (or smaller multiple samples) simultaneously.
The capacity range on the DL systems make these ideal for small research laboratories through to production environments. Typical materials include sapphire, silicon carbide or gallium nitride.
The lapping carrier is motor driven to ensure sample rotation during processing, resulting in excellent wafer uniformity and wafer to wafer uniformity.
Typical Surface Finish Capabilities:
Sapphire: <1nm
GaN: <1nm
SiC: <3nm
Material removal rates, typically: 4-10 microns per hour.
Key Features
- Process up to 200mm (8″) samples
- Ideal for lapping Silicon Carbide, Gallium Nitride and Sapphire
- Driven lapping jig provides high geometric accuracy
- Designed for hazardous materials such as Gallium Arsenide or Indium Phosphide
