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CS30 Compact Trim Saw

Description

The Logitech CS30 Compact Trim Saw is a robust saw specifically evolved for thin section preparation. The standard saw is fitted with a 200mm diameter diamond blade which is suitable for cutting a wide variety of materials.

The CS30 Compact Trim Saw is ideal for the thinning of slide-mounted specimens down to 500µm, ready for second face lapping. A ceramic vacuum chuck (which keeps slide distortion to a minimum) holds two slides 28 x 48mm or 26 x 46mm while the blade cuts through the material.

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Key Features

Versatile and robust trim saw
Ideal for trimming; rock, concrete, fossils and bone
Accepts 2 of 28mm x 48mm or 1 of 26mm x 76mm slides
Trims slide mounted specimens down to 500 micron

Product Specification:

Motor:	240/110V, 50/60Hz; 0.25kw belt drive
Blade:	200mm diameter; 1.5mm thick; 22mm arbor; 1800 r.p.m
Slide Size:	2 of 28 x 48mm/26 x 46mm or 1 of 26 x 76mm
Dimensions:	530 x 240 x 300mm
Net Weight:	30kg

Geological Sciences

In many areas of geological study such as mineralogy, petrography and sedimentology you are required to analyse the characteristics of the materials such as soil or rock. To be able to do this a thin section needs to be prepared for microscopic examination.

Logitech precision equipment is ideal for thin or ultra-thin section preparation. Our wide range of versatile systems enable you to trim, lap and polish geological thin sections such as rock, coal, concete and soils.

Each of our systems are fully supported by a wide range of accessories and consumables, such as abrasive powders, polishing cloths and mounting media.

Saw Blades & Cutting Wires

High quality diamond and silicon carbide saw blades and a selection of steel and diamond cutting wire to fit all Logitech saws.

Carrier Disc & Substrates

Logitech glass carrier discs are used for the temporary support of both semiconductor and opto-electronics wafers during thinning and polishing operations.

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