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  • Products & Solutions
    • Lapping & Polishing
    • Chemical Polishing & Chemical Mechanical Polishing
    • Driven Head Lapping & Polishing Tools
    • Bonding & Impregnation Units
    • Test & Measurement
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Home  /  Cutting & Sawing  /  AWS Abrasive Wire Saw

AWS Abrasive Wire Saw

Categories: Cutting & Sawing, View All
  • AWS Abrasive Wire Saw
  • AWS1 Saw
  • AWS1 Saw
  • AWS Abrasive Wire Saw
  • AWS1 Saw
  • AWS1 Saw
  • Description
  • Facilities Requirement
  • Applications
  • Accessories & Consumables

Description

The AWS Abrasive Wire Saw allows fragile or difficult materials to be cut or wafered without sample damage.  The saw uses fine lapping and cutting technology to perform cuts with minimal material loss and minimal sample damage.

The variable wire speed and cutting load on this saw enables it to be used for a wide range of materials including expensive materials, such as Cadmium Zinc Telluride or YAG laser rods.

The AWS Abrasive Wire Saw is a compact, bench-top wire saw and can slice samples up to 100mm (4″) in diameter with a maximum boule/sample length of 100mm (4″).

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Key Features

  • High cutting performance with minimal material loss
  • High cut quality with minimal material damage
  • Accepts samples up to 100 x 100mm (4″ x 4″)
  • Simple, safe sample mounting

Product Specifications:

Power Supply: 220/240V, 50Hz or 110V, 50/60Hz
Main Drive Motor: 0.18kW
Height: 630mm (excl autofeed)
Width: 510mm
Depth: 410mm
Weight: 46kg
Cutting Wire Length: 30.48m
Cutting Wire Diameter: 0.25mm or 0.20mm

Semiconductors

semiconductors

Semiconductor materials are used in a wide variety of devices such as field effect transistors (MosFets, Fets), integrated circuits (ICs, MMICs, ASICs), focal plane arrays and infra-red detectors.

Whatever the application or material, each semiconductor wafer undergoes several common stages during manufacture, which include slicing the wafer from the crystal, preparing the surface prior to fabrication and thinning the device after fabrication through the use of lapping and polishing techniques.

Logitech provide complete system solutions including consumables for the precise thinning of these III-V, I.R. and similar materials.

Geological Sciences

geologicalsciences

In many areas of geological study such as mineralogy, petrography and sedimentology you are required to analyse the characteristics of the materials such as soil or rock.  To be able to do this a thin section needs to be prepared for microscopic examination.

Logitech precision equipment is ideal for thin or ultra-thin section preparation.  Our wide range of versatile systems enable you to trim, lap and polish geological thin sections such as rock, coal, concete and soils.

Each of our systems are fully supported by a wide range of accessories and consumables, such as abrasive powders, polishing cloths and mounting media.

Optoelectronics

optoelectronics

Advances in communication technology have led to the development of a wide variety of optoelectronics and integrated optics devices for applications such as; dense wavelength division multiplexing (DWDM), optical isolators, signal processors and optical switching.

Logitech has a large selection of adaptable systems for the preparation of optoelectronic materials such as; silicon, lithium niobate, lithium tantalate, bismuith silicon oxide, barium titanate and similar materials.

Our systems, accessories and consumables provide defect free face and edge polishing on optoelectronic substrate and scratch free surfaces with exacting and repeatable dimensional tolerances.

Optics

optics

The importance of optical polishing and the processing of optical components has never been greater with the ongoing development of the telecommunications market. Whether for Infra Red and polymer waveguide production or fibre optic cable polishing.

The precision design and manufacture of our equipment enable you to obtain maximum results from the cutting, lapping and polishing of these optical materials.

Other Applications

otherapplications

Logitech systems are used by organisations across the world for many different complex sample preparation processes.

Including the thin section preparation of; Teeth, Bone, Otoliths, Ceramics, Metals, Alloys, Polymers and other Carbon-based materials.

Saw Blades & Cutting Wires

High quality diamond and silicon carbide saw blades and a selection of steel and diamond cutting wire to fit all Logitech saws.

M27 Soluble Oil

Logitech M27 soluble oil is a coolant for use with a Logitech APD1 or APD2 saw.

Ceramic Tiles

Unglazed ceramic mounting tiles for use with a Logitech APD1 or APD2 saw.

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Expert news and views to help sharpen your cutting edge

DIAMONDS ARE AN ENGINEER’S BEST FRIEND

In recent years, diamond has emerged as not only a girl’s best friend, but also as contender as an engineer’s best friend – if the technical challenges of exploiting its remarkable properties can be overcome.

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THE END OF THE CHIP FOR SILICON?

Silicon-based semiconducting integrated circuits have changed the world immeasurably over the past 50 years. Today the number of silicon chips in use far outweighs the number of humans currently alive.

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OPTIMAL FRICTION FOR OPTIMAL FLATNESS

The wafers used to make semiconducting chips for electronic devices all have one thing in common – they need to be smooth – super smooth. Typically, wafer flatness needs to be controlled within ±2 μm.

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