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APD1 Precision annular & peripheral saw

Description

Logitech’s APD1 Precision saw is a combined annular and peripheral saw, ideal for slicing samples such as wafers, crystals or semiconductor components up to 55mm in diameter with minimal kerf loss or for precision dicing of wafers up to 100mm (4″) in diameter.

Offering the option of a unique combination of annular slicing and peripheral cutting facilities in one precision saw, the slicing of semiconductor wafers from the crystal boule and their subsequent cutting into substrates can take place on one unit.

The APD1 is designed to allow specimens to be accurately and thinly cut and sliced with the minimum of surface damage and kerf loss. Programmed automatic operation permits repeated cuts to be made to selected thicknesses and diameters, allowing unattended operation throughout.

The saw is easily operated through set parameters such as cut depth, cut thickness, and the number of cuts to be carried out.

The APD1 precision saw is an effective tool in applications such as:

cutting and wafering of crystals
sectioning of electronic components
dicing semiconductor components
slotting to depth

and the cutting of a wide range of glasses, ceramics, rock samples and electro-optic materials.

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Key Features

Annular and peripheral cutting in a single unit
High precision, low damage slicing with minimal kerf loss
Single or multiple cuts
Automatic or manual operation
Compact, modern design

Product Specification:

Power Supply:	220/240V, 50Hz
Main Drive Motor:	10 V d.c., 0.37kW
Height:	670mm
Width:	600mm
Depth:	765mm
Max depth of cut annular mode:	55mm
Max depth of cut peripheral mode:	100mm
Min Drum Speed:	100rpm
Max Drum Speed annular mode:	3000rpm
Max Drum Speed peripheral mode:	5000rpm
Min Feed Rate:	0.01mm/sec
Max Feed Rate:	2.0mm/sec
Positional Accuracy:	5 microns
Coolant Tank:	15 litre capacity

Optoelectronics

Advances in communication technology have led to the development of a wide variety of optoelectronics and integrated optics devices for applications such as; dense wavelength division multiplexing (DWDM), optical isolators, signal processors and optical switching.

Logitech has a large selection of adaptable systems for the preparation of optoelectronic materials such as; silicon, lithium niobate, lithium tantalate, bismuith silicon oxide, barium titanate and similar materials.

Our systems, accessories and consumables provide defect free face and edge polishing on optoelectronic substrate and scratch free surfaces with exacting and repeatable dimensional tolerances.

Optics

The importance of optical polishing and the processing of optical components has never been greater with the ongoing development of the telecommunications market. Whether for Infra Red and polymer waveguide production or fibre optic cable polishing.

The precision design and manufacture of our equipment enable you to obtain maximum results from the cutting, lapping and polishing of these optical materials.

Semiconductors

Semiconductor materials are used in a wide variety of devices such as field effect transistors (MosFets, Fets), integrated circuits (ICs, MMICs, ASICs), focal plane arrays and infra-red detectors.

Whatever the application or material, each semiconductor wafer undergoes several common stages during manufacture, which include slicing the wafer from the crystal, preparing the surface prior to fabrication and thinning the device after fabrication through the use of lapping and polishing techniques.

Logitech provide complete system solutions including consumables for the precise thinning of these III-V, I.R. and similar materials.

Saw Blades & Cutting Wires

High quality diamond and silicon carbide saw blades and a selection of steel and diamond cutting wire to fit all Logitech saws.

Ceramic Tiles

Unglazed ceramic mounting tiles for use with a Logitech APD1 or APD2 saw.

M27 Soluble Oil

Logitech M27 soluble oil is a coolant for use with a Logitech APD1 or APD2 saw.

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