Logitech customer, Emcore, world leading provider of performance leading optical components for broadband as well as Indium Phosphide chip solutions for FTTx, Data Centre, 4g LTE and 5G Wireless applications, have recently re-tooled their world-class wafer fabrication facility completely with Logitech PM6 Precision Lapping & Polishing Systems. Their decision to utilise the PM6 was based on the breadth of features the system offers that has subsequently enhanced their wafer quality and throughput levels. Their class 1000 clean room facilities now consist of multiple PM6 units.
Over the last 12 months, Logitech process development engineers have completed a full wafer fabrication installation on-site at Emcore’s facilities in Alhambra, California, USA. Logitech are now Emcore’s sole source provider of lapping and polishing tools, as well as consumable products for processing II-V semiconductor materials and Oxides. Emcore is utilising the key functionality of the PM6 system to maximise their wafer fabrication productivity. Features such as metered abrasive delivery and driven-jig-roller-arm allow for increased material removal rates (MRR) with greater control. The machines currently run two concurrent processing shifts per day, totaling 16 hours of processing within 24 hours, so the robust design of the PM6 allows the machine to run safely for great lengths of time without fear of breakdown or sample damage.
Emcore is successfully achieving stringent specifications lapping and chemically etching their wafers with minimal subsurface damage. Unique polishing requirements designed to maximize throughput is being achieved by utilising custom fixturing from Logitech that accommodates the polishing of up to 100 wafers at the one time. Intelligent functionality of the PM6, such as real time data collection and feedback from digital indicators on the precision jigs, allows greater end-point thickness control for increased accuracy, enabling Emcore operators to completely optimise their processes.