When working with fragile materials you may need to bond the sample to a glass slide or substrate. This will support the sample during processing.
Logitech have a number of options for bonding samples to substrates, such as thin section bonding jigs or wafer substrate bonding units. These are used with Logitech adhesive consumables such as epoxy resin, quartz wax, thin film bonding wax and araldite mounting resin.
Logitech Thin Section Bonding Jigs enable you to control the thickness of your bonding for precise bond orientation. These jigs are ideal when working with ultra thin geological samples.
The Wafer Substrate Bonding Units offer premium bonding for the processing of fragile semiconductor wafers such as silicon or gallium arsenide.