Logitech systems are used for the materials processing of a wide range of applications.
To assist you in identifying the most appropriate application, we have developed a range of support material such as Application Notes and Technology Brochures to help you to make an informed choice when purchasing a Logitech system.
Bringing a wealth of knowledge and problem solving skills in wafer surfacing, wafer thinning (back lapping) and geometric control.
Delivering a wide range of versatile systems for trimming, lapping and polishing geological thin sections.
Our precision systems ensure you achieve the highest results possible.
Our systems offer versatility, flexibility and reliability across a wide range of applications.