Logitech systems are used for the materials processing of a wide range of applications.
To assist you in identifying the most appropriate application, we have developed a range of support material such as Application Notes and Technology Brochures to help you to make an informed choice when purchasing a Logitech system.
Bringing a wealth of knowledge and problem solving skills in wafer surfacing, wafer thinning (back lapping) and geometric control.
Delivering a wide range of versatile systems for trimming, lapping and polishing geological thin sections.
Our systems offer versatility, flexibility and reliability across a wide range of applications.