Logitech DL high speed lapping systems process materials with high geometric precision. The four station DL4 is capable of processing up to 4 200mm (8″) samples (or smaller multiple samples) simultaneously.
The capacity range on the DL systems make these ideal for small research laboratories through to production environments. Typical materials include sapphire, silicon carbide or gallium nitride.
The lapping carrier is motor driven to ensure sample rotation during processing, resulting in excellent wafer uniformity and wafer to wafer uniformity.
Typical Surface Finish Capabilities:
Material removal rates, typically: 4-10 microns per hour.