The production of thin and ultra-thin sections of materials required that the sample material be fixed to a substrate, such as a microscope slide. It is important that the orientation of the sample-bond-substrate is controlled for achieving optimal sample thickness control and parallelism.
“zero bonding” and “controlled thickness bonding” are two important techniques developed by Logitech to enable bond orientation and thickness to be controlled easily and with great precision.
The thin section bonding jig range:
The twelve position BJ12 “zero-bonding” jig has two sets of six loading pistons on either side of the central line to enable the jig to accept larger sections if required. Four bonding stations are equipped with a large section facility which comprises a large area load spreader. This jig is typically used with two or three workstation rock section lapping systems. Twelve PTFE load spreaders are supplied with every jig.
The six position BJ9 “zero-bonding” jig features two bonding stations. Using two load spreaders, it is particularly suitable for simultaneously bonding two large format geological thin sections.
The six position BJ6 “zero-bonding” jig is identical to the BJ12 jig but with six pistons. Two bonding stations are equipped with the large section facility. Six PTFE load spreaders are supplied with every jig. This jig is typically used in single workstation geological sample preparation systems or for the bonding of semiconductor wafers.
This bonding jig is a two piston version of the BJ6. Both bonding stations can accommodate up to 100mm (4″) diameter samples. It is ideal for bonding Lithium Niobate (LiNb03) stacks/wafers for subsequent edge lapping and polishing. The BJ2 includes an aluminium block to ensure the bonding resin is evenly spread.
- Effective “zero bonding”
- Controlled thickness bonding
- Precise bond orientation
- Large or multiple sample capacity
- Bonding jigs available for large or small scale operations