The APD1 is a combined annular and peripheral saw, ideal for slicing samples such as wafers, crystals or semiconductor components up to 55mm in diameter with minimal kerf loss or for precision dicing of wafers up to 100mm (4″) in diameter.
Offering the option of a unique combination of annular slicing and peripheral cutting facilities in one precision saw, the slicing of semiconductor wafers from the crystal boule and their subsequent cutting into substrates can take place on one unit.
The APD1 is designed to allow specimens to be accurately and thinly cut and sliced with the minimum of surface damage and kerf loss. Programmed automatic operation permits repeated cuts to be made to selected thicknesses and diameters, allowing unattended operation throughout.
The saw is easily operated through set parameters such as cut depth, cut thickness, and the number of cuts to be carried out.
The APD1 precision saw is an effective tool in applications such as:
- cutting and wafering of crystals
- sectioning of electronic components
- dicing semiconductor components
- slotting to depth
and the cutting of a wide range of glasses, ceramics, rock samples and electro-optic materials.
- Annular and peripheral cutting in a single unit
- High precision, low damage slicing with minimal kerf loss
- Single or multiple cuts
- Automatic or manual operation
- Compact, modern design